SBOSA05C August   2021  – November 2022 LMH32404

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Electrical Characteristics: Logic Threshold and Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Clamping and Input Protection
      2. 7.3.2 ESD Protection
      3. 7.3.3 Differential Output Stage
    4. 7.4 Device Functional Modes
      1. 7.4.1 Ambient Light Cancellation (ALC) Mode
      2. 7.4.2 Channel Multiplexer Mode
      3. 7.4.3 Low-Power Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Standard TIA Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Increase Channel Density for Optical Front-End Systems
        1. 8.2.2.1 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision B (February 2022) to Revision C (November 2022)

  • Changed the status of the bare die package from: preview to: active Go

Changes from Revision A (November 2021) to Revision B (February 2022)

  • Added bare die preview package to the Features section and Device Information tableGo
  • Added the bare die preview package to the Pin Configuration and Functions sectionGo

Changes from Revision * (August 2021) to Revision A (November 2021)

  • Updated the JEDEC reference in the ESD Ratings table from JESD22-C101 to JEDEC JS-002 Go
  • Updated the Overview sectionGo
  • Updated the Clamping and Input Protection sectionGo
  • Updated the Differential Output Stage sectionGo
  • Updated the Ambient Light Cancellation (ALC) Mode sectionGo