SNOSAL8D April   2006  – September 2021 LMH6321

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Operating Ratings
    3. 5.3 Thermal Information
    4. 5.4 ±15 V Electrical Characteristics
    5. 5.5 ±5 V Electrical Characteristics
    6. 5.6 Typical Characteristics
  6. 6Application Hints
    1. 6.1  Buffers
    2. 6.2  Supply Bypassing
    3. 6.3  Load Impedence
    4. 6.4  Source Inductance
    5. 6.5  Overvoltage Protection
    6. 6.6  Bandwidth and Stability
    7. 6.7  Output Current and Short Circuit Protection
    8. 6.8  Thermal Management
      1. 6.8.1 Heatsinking
      2. 6.8.2 Determining Copper Area
      3. 6.8.3 Procedure
      4. 6.8.4 Example
    9. 6.9  Error Flag Operation
    10. 6.10 Single Supply Operation
    11. 6.11 Slew Rate
  7. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  8. 8Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • KTW|7
  • DDA|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Thermal Information

THERMAL METRIC1 LMH6321 UNIT
DDA SO Power Pad DDAPAK
8 Pins 7 Pins
R θJA Junction-to-ambient thermal resistance 37.8 21.5 °C/W
R θJC(top) Junction-to-case (top) thermal resistance 51.6 34.4 °C/W
R θJB Junction-to-board thermal resistance 11.7 6.7 °C/W
ψ JT Junction-to-top characterization parameter 2.5 3.2 °C/W
ψ JB Junction-to-board characterization parameter 11.7 6.3 °C/W
R θJC(bot) Junction-to-case (bottom) thermal resistance 3.6 1.1 °C/W