SNOSAL8D April   2006  – September 2021 LMH6321

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Operating Ratings
    3. 5.3 Thermal Information
    4. 5.4 ±15 V Electrical Characteristics
    5. 5.5 ±5 V Electrical Characteristics
    6. 5.6 Typical Characteristics
  6. 6Application Hints
    1. 6.1  Buffers
    2. 6.2  Supply Bypassing
    3. 6.3  Load Impedence
    4. 6.4  Source Inductance
    5. 6.5  Overvoltage Protection
    6. 6.6  Bandwidth and Stability
    7. 6.7  Output Current and Short Circuit Protection
    8. 6.8  Thermal Management
      1. 6.8.1 Heatsinking
      2. 6.8.2 Determining Copper Area
      3. 6.8.3 Procedure
      4. 6.8.4 Example
    9. 6.9  Error Flag Operation
    10. 6.10 Single Supply Operation
    11. 6.11 Slew Rate
  7. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  8. 8Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • KTW|7
  • DDA|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The LMH6321 is a high speed unity gain buffer that slews at 1800 V/µs and has a small signal bandwidth of 110 MHz while driving a 50 Ω load. It can drive ±300 mA continuously and will not oscillate while driving large capacitive loads.

The LMH6321 features an adjustable current limit. The current limit is continuously adjustable from 10 mA to 300 mA with a ±5 mA ±5% accuracy. The current limit is set by adjusting an external reference current with a resistor. The current can be easily and instantly adjusted, as needed by connecting the resistor to a DAC to form the reference current. The sourcing and sinking currents share the same current limit.

The LMH6321 is available in a space saving 8-pin SO PowerPAD or a 7-pin DDPAK power package. The SO PowerPAD™ package features an exposed pad on the bottom of the package to increase its heat sinking capability. The LMH6321 can be used within the feedback loop of an operational amplifier to boost the current output or as a stand alone buffer.

Table 3-1 Device Information
PART NUMBER PACKAGE(1) BODY SIZE (NOM)
LMH6231 SO PowerPAD (8) 1.7 mm × 1.27 mm
DDPAK (7) 4.65 mm × 1.27 mm
(1) For all available packages, see the orderable addendum at the end of the data sheet.
GUID-5C4EDBDA-D2F6-49F4-83F8-C5146DDEB8CA-low.gifFigure 3-1 Connection Diagram: 8-Pin SO PowerPAD
GUID-6D6076A2-16E7-4355-A9E5-7AF9CACBF6B6-low.gif
V− pin is connected to tab on back of each package.
Figure 3-2 Connection Diagram: 7-Pin DDPAK(A)