SNOSB21E May   2008  – July 2024 LMH6518

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Preamplifier
        1. 6.3.1.1 Primary Output Amplifier
        2. 6.3.1.2 Auxiliary Amplifier
      2. 6.3.2 Overvoltage Clamp
      3. 6.3.3 Attenuator
      4. 6.3.4 Digital Control Block
    4. 6.4 Device Functional Modes
      1. 6.4.1 Primary Amplifier
      2. 6.4.2 Auxiliary Output
    5. 6.5 Programming
      1. 6.5.1 Logic Functions
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Oscilloscope Front End
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Settings and ADC SPI Code (ECM)
          2. 7.2.1.2.2 Input and Output Considerations
            1. 7.2.1.2.2.1 Output Swing, Clamping, and Operation Beyond Full Scale
          3. 7.2.1.2.3 Oscilloscope Trigger Applications
        3. 7.2.1.3 Application Curves
      2. 7.2.2 JFET LNA Implementation
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
          1. 7.2.2.2.1 Attenuator Design
        3. 7.2.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
      2. 8.1.2 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGH|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Application and Implementation

Note:

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.