SNOSAK9F June   2006  – June 2015 LMH6601 , LMH6601-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings - for LMH6601
    3. 6.3  ESD Ratings - for LMH6601-Q1
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics, 5 V
    7. 6.7  Electrical Characteristics, 3.3 V
    8. 6.8  Electrical Characteristics, 2.7 V
    9. 6.9  Switching Characteristics, 5 V
    10. 6.10 Switching Characteristics, 3.3 V
    11. 6.11 Switching Characteristics, 2.7 V
    12. 6.12 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1 Shutdown Capability and Turn On/Off Behavior
      2. 7.2.2 Overload Recovery and Swing Close to Rails
    3. 7.3 Device Functional Modes
      1. 7.3.1 Optimizing Performance
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 DC-Coupled, Single-Supply Baseband Video Amplifier and Driver
      2. 8.1.2 How to Pick the Right Video Amplifier
      3. 8.1.3 Current to Voltage Conversion (Transimpedance Amplifier (TIA)
      4. 8.1.4 Transimpedance Amplifier Noise Considerations
      5. 8.1.5 Charge Preamplifier
      6. 8.1.6 Capacitive Load
    2. 8.2 Typical Application
      1. 8.2.1 SAG Compensation for AC-Coupled Video
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
      4. 8.2.4 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Layout

10.1 Layout Guidelines

Generally, a good high-frequency layout will keep power supply and ground traces away from the inverting input and output pins. Parasitic capacitances on these nodes to ground will cause frequency response peaking and possible circuit oscillations (see Application Note OA-15, Frequent Faux Pas in Applying Wideband Current Feedback Amplifiers, SNOA367, for more information).

10.2 Layout Examples

LMH6601 LMH6601-Q1 lay01_silk_snosak9.gif
SC-70 Board Layout (Actual size = 1.5 in × 1.5 in
Figure 64. Layer 1 Silk
LMH6601 LMH6601-Q1 lay02_silk_snosak9.jpg
SC-70 Board Layout (Actual size = 1.5 in × 1.5 in
Figure 65. Layer 2 Silk