SNOSAQ2F July   2005  – August 2024 LMH6702QML-SP

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Quality Conformance Inspection
    4. 5.4 Electrical Characteristics: DC Parameters
    5. 5.5 Electrical Characteristics: AC Parameters
    6. 5.6 Electrical Characteristics: Drift Values Parameters
    7. 5.7 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Feedback Resistor
      2. 6.1.2 Harmonic Distortion
      3. 6.1.3 Capacitive Load Drive
      4. 6.1.4 DC Accuracy and Noise
    2. 6.2 Layout
      1. 6.2.1 Layout Guidelines
  8. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • NAB|8
  • NAC|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.2.1 Layout Guidelines

Generally, a good high frequency layout keeps power supply and ground traces away from the inverting input and output pins. Parasitic capacitance on these nodes to ground cause frequency-response peaking and possible circuit oscillations (see the OA-15 Frequent Faux Pas in Applying Wideband Current Feedback Amplifiers application report for more information). Texas Instruments suggests the following evaluation boards as a guide for high-frequency layout and as an aid in device testing and characterization:

DEVICE PACKAGE EVALUATION BOARD PART NUMBER
LMH6702QMLMF SOT-23-5 CLC730216
LMH6702QMLMA Plastic SOIC CLC730227