SNOSAQ2F July   2005  – August 2024 LMH6702QML-SP

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Quality Conformance Inspection
    4. 5.4 Electrical Characteristics: DC Parameters
    5. 5.5 Electrical Characteristics: AC Parameters
    6. 5.6 Electrical Characteristics: Drift Values Parameters
    7. 5.7 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Feedback Resistor
      2. 6.1.2 Harmonic Distortion
      3. 6.1.3 Capacitive Load Drive
      4. 6.1.4 DC Accuracy and Noise
    2. 6.2 Layout
      1. 6.2.1 Layout Guidelines
  8. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • NAB|8
  • NAC|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Electrical Characteristics: DC Parameters

The following conditions apply (unless otherwise specified)(1)(2):
RL = 100Ω, VCC = ±5VDC, AV = +2 feedback resistor (RF) = 250Ω, gain resistor (RG) = 250Ω
PARAMETER TEST CONDITIONS NOTES MIN MAX UNIT SUB- GROUPS
IBN Input bias current, noninverting –15 15 μA 1, 2
–21 21 μA 3
IBI Input bias current, inverting –30 30 μA 1, 2
–34 34 μA 3
VIO Input offset voltage –4.5 4.5 mV 1, 3
–6.0 6.0 mV 2
ICC Supply current, no load RL = ∞ 15 mA 1, 2, 3
PSSR Power supply rejection ratio –VCC = –4.5V to –5.0V,
+VCC = 4.5V to 5.0V		 45 dB 1, 2, 3
(1) The algebraic convention, whereby the most negative value is a minimum and most positive is a maximum, is used in this table. Negative current shall be defined as conventional current flow out of a device terminal.
(2) Pre- and post-irradiation limits are identical to those listed under the dc parameter tables. Post-irradiation testing is conducted at room temperature, 25°C, only. Testing is performed as specified in MIL-STD-883 Test Method 1019 Condition A. The ELDRS-Free part is also tested per Test Method 1019 Conditions D.