SNAS573D January   2012  – September 2021 LMK01801

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
    1. 5.1 Functional Configurations
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Recommended Operating Conditions
    3. 7.3 Thermal Information
    4. 7.4 Electrical Characteristics
    5. 7.5 Serial MICROWIRE Timing Diagram
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Differential Voltage Measurement Terminology
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  High-Speed Clock Inputs (CLKin0/CLKin0* and CLKin1/CLKin1*)
      2. 9.3.2  Clock Distribution
      3. 9.3.3  Small Divider (1 to 8)
      4. 9.3.4  Large Divider (1 to 1045)
      5. 9.3.5  CLKout Analog Delay
      6. 9.3.6  CLKout0 to CLKout11 Digital Delay
      7. 9.3.7  CLKout12 and CLKout13 Digital Delay
      8. 9.3.8  Programmable Outputs
      9. 9.3.9  Clock Output Synchronization
      10. 9.3.10 Default Clock Outputs
    4. 9.4 Device Functional Modes
      1. 9.4.1 Programmable Mode
      2. 9.4.2 Pin Control Mode
      3. 9.4.3 Inputs / Outputs
        1. 9.4.3.1 CLKin0 and CLKin1
      4. 9.4.4 Input and Output Dividers
      5. 9.4.5 Fixed Digital Delay
        1. 9.4.5.1 Fixed Digital Delay - Example
      6. 9.4.6 Clock Output Synchronization (SYNC)
        1. 9.4.6.1 Dynamically Programming Digital Delay
          1. 9.4.6.1.1 Relative Dynamic Digital Delay
          2. 9.4.6.1.2 Relative Dynamic Digital Delay - Example
    5. 9.5 Programming
      1. 9.5.1 Recommended Programming Sequence
        1. 9.5.1.1 Overview
    6. 9.6 Register Map
      1. 9.6.1 Default Device Register Settings After Power On/Reset
      2. 9.6.2 Register R0
        1. 9.6.2.1 RESET
        2. 9.6.2.2 POWERDOWN
        3. 9.6.2.3 CLKoutX_Y_PD
          1. 9.6.2.3.1 CLKinX_BUF_TYPE
          2. 9.6.2.3.2 CLKinX_DIV
          3. 9.6.2.3.3 CLKinX_MUX
      3. 9.6.3 Register R1 and R2
        1. 9.6.3.1 CLKoutX_TYPE
      4. 9.6.4 Register R3
        1. 9.6.4.1 CLKout12_13_ADLY
        2. 9.6.4.2 CLKout12_13_HS, Digital Delay Half Shift
        3. 9.6.4.3 SYNC1_QUAL
        4. 9.6.4.4 SYNCX_POL_INV
        5. 9.6.4.5 NO_SYNC_CLKoutX_Y
        6. 9.6.4.6 CLKoutX_Y_OFFSET_PD
        7. 9.6.4.7 SYNCX_FAST
        8. 9.6.4.8 SYNCX_AUTO
      5. 9.6.5 Register R4
        1. 9.6.5.1 CLKout12_13_DDLY, Clock Channel Digital Delay
      6. 9.6.6 Register R5
        1. 9.6.6.1 CLKout12_ADLY_SEL[13], CLKout13_ADLY_SEL[14], Select Analog Delay
        2. 9.6.6.2 CLKoutX_Y_DIV Clock Output Divide
      7. 9.6.7 Register 15
        1. 9.6.7.1 uWireLock
  10. 10Application and Implementation
    1. 10.1 Typical Application
      1. 10.1.1 Detailed Design Procedure
        1. 10.1.1.1 Driving CLKin Inputs
          1. 10.1.1.1.1 Driving CLKin Pins With a Differential Source
          2. 10.1.1.1.2 Driving CLKin Pins With a Single-Ended Source
        2. 10.1.1.2 Termination and Use of Clock Output (Drivers)
          1. 10.1.1.2.1 Termination for DC-Coupled Differential Operation
          2. 10.1.1.2.2 Termination for AC-Coupled Differential Operation
          3. 10.1.1.2.3 Termination for Single-Ended Operation
  11. 11Power Supply Recommendations
    1. 11.1 Current Consumption
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Pin Connection Recommendations
        1. 12.1.1.1 Vcc Pins and Decoupling
        2. 12.1.1.2 Unused clock outputs
        3. 12.1.1.3 Unused clock inputs
        4. 12.1.1.4 Unused GPIO (CLKoutTYPE_X)
        5. 12.1.1.5 Bias
        6. 12.1.1.6 In MICROWIRE Mode
    2. 12.2 Thermal Management
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12.2 Thermal Management

Power consumption of the LMK01801 can be high enough to require attention to thermal management. For reliability and performance reasons the die temperature should be limited to a maximum of 125°C. That is, as an estimate, TA (ambient temperature) plus device power consumption times θJA should not exceed 125°C.

The package of the device has an exposed pad that provides the primary heat removal path as well as excellent electrical grounding to a printed circuit board. To maximize the removal of heat from the package a thermal land pattern including multiple vias to a ground plane must be incorporated on the PCB within the footprint of the package. The exposed pad must be soldered down to ensure adequate heat conduction out of the package.

A recommended footprint including recommended solder mask and solder paste layers can be found at: http://www.ti.com/packaging for the RHS0048A package.