SNAS522K September   2011  – December 2023 LMK03806

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Differential Voltage Measurement Terminology
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Features Description
      1. 7.3.1 Serial MICROWIRE Timing Diagram and Terminology
      2. 7.3.2 Crystal Support With Buffered Outputs
      3. 7.3.3 Integrated Loop Filter Poles
      4. 7.3.4 Integrated VCO
      5. 7.3.5 Clock Distribution
        1. 7.3.5.1 CLKout DIvider
        2. 7.3.5.2 Programmable Output Type
        3. 7.3.5.3 Clock Output Synchronization
      6. 7.3.6 Default Start-Up Clocks
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 General Information
        1. 7.5.1.1 Special Programming Case for R0 to R5 for CLKoutX_Y_DIV > 25
        2. 7.5.1.2 Recommended Initial Programming Sequence
        3. 7.5.1.3 READBACK
          1. 7.5.1.3.1 Readback Example
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Crystal Interface
      2. 8.1.2 Driving OSCin Pins With a Single-Ended Source
      3. 8.1.3 Driving OSCin Pins With a Differential Source
      4. 8.1.4 Frequency Planning With the LMK03806
      5. 8.1.5 Configuring the PLL
        1. 8.1.5.1 Example PLL Configuration
      6. 8.1.6 Digital Lock Detect
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Device Selection
          1. 8.2.2.1.1 Clock Architect
          2. 8.2.2.1.2 Clock Design Tool
          3. 8.2.2.1.3 Calculation Using LCM
        2. 8.2.2.2 Device Configuration
        3. 8.2.2.3 PLL Loop Filter Design
          1. 8.2.2.3.1 Example Loop Filter Design
        4. 8.2.2.4 Other Device Specific Configuration
          1. 8.2.2.4.1 Digital Lock Detect
        5. 8.2.2.5 Device Programming
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 System Level Diagram
    4. 8.4 Best Design Practices
      1. 8.4.1 LVCMOS Complementary vs. Non-Complementary Operation
      2. 8.4.2 LVPECL Outputs
      3. 8.4.3 Sharing MICROWIRE (SPI) Lines
      4. 8.4.4 SYNC Pin
      5. 8.4.5 CLKout Vcc Pins
    5. 8.5 Power Supply Recommendations
      1. 8.5.1 Current Consumption and Power Dissipation Calculations
    6. 8.6 Layout
      1. 8.6.1 Layout Guidelines
      2. 8.6.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Register Maps
    1. 10.1  Default Device Register Settings After Power On Reset
    2. 10.2  Register R0 TO R5
      1. 10.2.1 CLKoutX_Y_PD, Powerdown CLKoutX_Y Output Path
      2. 10.2.2 RESET
      3. 10.2.3 POWERDOWN
      4. 10.2.4 CLKoutX_Y_DIV, Clock Output Divide
    3. 10.3  Registers R6 TO R8
      1. 10.3.1 CLKoutX_TYPE
    4. 10.4  REGISTER R9
    5. 10.5  REGISTER R10
      1. 10.5.1 OSCout1_TYPE, LVPECL Output Amplitude Control
      2. 10.5.2 OSCout0_TYPE
      3. 10.5.3 EN_OSCoutX, OSCout Output Enable
      4. 10.5.4 OSCoutX_MUX, Clock Output Mux
      5. 10.5.5 OSCout_DIV, Oscillator Output Divide
    6. 10.6  REGISTER R11
      1. 10.6.1 NO_SYNC_CLKoutX_Y
      2. 10.6.2 SYNC_POL_INV
      3. 10.6.3 SYNC_TYPE
      4. 10.6.4 EN_PLL_XTAL
    7. 10.7  REGISTER R12
      1. 10.7.1 LD_MUX
      2. 10.7.2 LD_TYPE
      3. 10.7.3 SYNC_PLL_DLD
    8. 10.8  REGISTER R13
      1. 10.8.1 READBACK_TYPE
      2. 10.8.2 GPout0
    9. 10.9  REGISTER 14
      1. 10.9.1 GPout1
    10. 10.10 REGISTER 16
    11. 10.11 REGISTER 24
      1. 10.11.1 PLL_C4_LF, PLL Integrated Loop Filter Component
      2. 10.11.2 PLL_C3_LF, PLL Integrated Loop Filter Component
      3. 10.11.3 PLL_R4_LF, PLL Integrated Loop Filter Component
      4. 10.11.4 PLL_R3_LF, PLL Integrated Loop Filter Component
    12. 10.12 REGISTER 26
      1. 10.12.1 EN_PLL_REF_2X, PLL Reference Frequency Doubler
      2. 10.12.2 PLL_CP_GAIN, PLL Charge Pump Current
      3. 10.12.3 PLL_DLD_CNT
    13. 10.13 REGISTER 28
      1. 10.13.1 PLL_R, PLL R Divider
    14. 10.14 REGISTER 29
      1. 10.14.1 OSCin_FREQ, PLL Oscillator Input Frequency Register
      2. 10.14.2 PLL_N_CAL, PLL N Calibration Divider
    15. 10.15 REGISTER 30
      1. 10.15.1 PLL_P, PLL N Prescaler Divider
      2. 10.15.2 PLL_N, PLL N Divider
    16. 10.16 REGISTER 31
      1. 10.16.1 READBACK_ADDR
      2. 10.16.2 uWire_LOCK
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Revision History

Changes from Revision J (March 2018) to Revision K (December 2023)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed the Device Information table to Packaging Information Go
  • Removed the external VCO text from the Clock Distribution sectionGo
  • Changed Figure 8-13 Go
  • Added CLKout Vcc Pins sectionGo

Changes from Revision I (November 2015) to Revision J (March 2018)

  • Removed unresolvable cross-references.Go
  • Added initial programming requirement of R3.Go
  • Changed readback text from "rising" to "falling".Go
  • Bolded pin 30 of register R3 for emphasis.Go
  • Added table note to Default Device Register Settings After Power On Reset to clarify proper use of CLKout6.Go
  • Added note to Register R0 TO R5 regarding programming R3.Go

Changes from Revision H (August 2012) to Revision I (November 2015)

  • Added Device Information table, ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. Go
  • Separated Timing Requirements into its own sectionGo
  • Moved Serial MICROWIRE Timing Diagram and Terminology sectionGo
  • Moved Achievable Frequencies table and Common Frequency Plans table to Device Functional Modes sectionGo
  • Added Driving OSCin Pins with a Differential Source sectionGo
  • Added Frequency Planning with the LMK03806 and Configuring the PLL sectionsGo
  • Moved Thermal Management section and renamed it to Layout Guidelines Go