SNAS703 April   2017 LMK04828-EP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 SPI Interface Timing
    7. 7.7 Timing Diagram
    8. 7.8 Typical Characteristics - Clock Output AC Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Charge Pump Current Specification Definitions
      1. 8.1.1 Charge Pump Output Current Magnitude Variation vs Charge Pump Output Voltage
      2. 8.1.2 Charge Pump Sink Current vs Charge Pump Output Source Current Mismatch
      3. 8.1.3 Charge Pump Output Current Magnitude Variation vs Ambient Temperature
    2. 8.2 Differential Voltage Measurement Terminology
  9. 9 Detailed Description
    1. 9.1 Overview
      1. 9.1.1  Jitter Cleaning
      2. 9.1.2  JEDEC JESD204B Support
      3. 9.1.3  Three PLL1 Redundant Reference Inputs (CLKin0/CLKin0*, CLKin1/CLKin1*, and CLKin2/CLKin2*)
      4. 9.1.4  VCXO or Crystal Buffered Output
      5. 9.1.5  Frequency Holdover
      6. 9.1.6  PLL2 Integrated Loop Filter Poles
      7. 9.1.7  Internal VCOs
      8. 9.1.8  External VCO Mode
      9. 9.1.9  Clock Distribution
        1. 9.1.9.1 Device Clock Divider
        2. 9.1.9.2 SYSREF Clock Divider
        3. 9.1.9.3 Device Clock Delay
        4. 9.1.9.4 SYSREF Delay
        5. 9.1.9.5 Glitchless Half Step and Glitchless Analog Delay
        6. 9.1.9.6 Programmable Output Formats
        7. 9.1.9.7 Clock Output Synchronization
      10. 9.1.10 0-Delay
      11. 9.1.11 Status Pins
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 SYNC/SYSREF
      2. 9.3.2 JEDEC JESD204B
        1. 9.3.2.1 How To Enable SYSREF
          1. 9.3.2.1.1 Setup of SYSREF Example
          2. 9.3.2.1.2 SYSREF_CLR
        2. 9.3.2.2 SYSREF Modes
          1. 9.3.2.2.1 SYSREF Pulser
          2. 9.3.2.2.2 Continuous SYSREF
          3. 9.3.2.2.3 SYSREF Request
      3. 9.3.3 Digital Delay
        1. 9.3.3.1 Fixed Digital Delay
          1. 9.3.3.1.1 Fixed Digital Delay Example
        2. 9.3.3.2 Dynamic Digital Delay
        3. 9.3.3.3 Single and Multiple Dynamic Digital Delay Example
      4. 9.3.4 SYSREF to Device Clock Alignment
      5. 9.3.5 Input Clock Switching
        1. 9.3.5.1 Input Clock Switching - Manual Mode
        2. 9.3.5.2 Input Clock Switching - Pin Select Mode
        3. 9.3.5.3 Input Clock Switching - Automatic Mode
      6. 9.3.6 Digital Lock Detect
        1. 9.3.6.1 Calculating Digital Lock Detect Frequency Accuracy
      7. 9.3.7 Holdover
        1. 9.3.7.1 Enable Holdover
          1. 9.3.7.1.1 Fixed (Manual) CPout1 Holdover Mode
          2. 9.3.7.1.2 Tracked CPout1 Holdover Mode
        2. 9.3.7.2 During Holdover
        3. 9.3.7.3 Exiting Holdover
        4. 9.3.7.4 Holdover Frequency Accuracy and DAC Performance
        5. 9.3.7.5 Holdover Mode - Automatic Exit of Holdover
    4. 9.4 Device Functional Modes
      1. 9.4.1 DUAL PLL
      2. 9.4.2 0-DELAY Dual PLL
    5. 9.5 Programming
      1. 9.5.1 Recommended Programming Sequence
        1. 9.5.1.1 SPI LOCK
        2. 9.5.1.2 SYSREF_CLR
    6. 9.6 Register Maps
      1. 9.6.1 Register Map for Device Programming
    7. 9.7 Device Register Descriptions
      1. 9.7.1 System Functions
        1. 9.7.1.1 RESET, SPI_3WIRE_DIS
        2. 9.7.1.2 POWERDOWN
        3. 9.7.1.3 ID_DEVICE_TYPE
        4. 9.7.1.4 ID_PROD[15:8], ID_PROD
        5. 9.7.1.5 ID_MASKREV
        6. 9.7.1.6 ID_VNDR[15:8], ID_VNDR
      2. 9.7.2 (0x100 - 0x138) Device Clock and SYSREF Clock Output Controls
        1. 9.7.2.1 CLKoutX_Y_ODL, CLKoutX_Y_IDL, DCLKoutX_DIV
        2. 9.7.2.2 DCLKoutX_DDLY_CNTH, DCLKoutX_DDLY_CNTL
        3. 9.7.2.3 DCLKoutX_DDLYd_CNTH, DCLKoutX_DDLYd_CNTL
        4. 9.7.2.4 DCLKoutX_ADLY, DCLKoutX_ADLY_MUX, DCLKout_MUX
        5. 9.7.2.5 DCLKoutX_HS, SDCLKoutY_MUX, SDCLKoutY_DDLY, SDCLKoutY_HS
        6. 9.7.2.6 SDCLKoutY_ADLY_EN, SDCLKoutY_ADLY
        7. 9.7.2.7 DCLKoutX_DDLY_PD, DCLKoutX_HSg_PD, DCLKout_ADLYg_PD, DCLKout_ADLY_PD, DCLKoutX_Y_PD, SDCLKoutY_DIS_MODE, SDCLKoutY_PD
        8. 9.7.2.8 SDCLKoutY_POL, SDCLKoutY_FMT, DCLKoutX_POL, DCLKoutX_FMT
      3. 9.7.3 SYSREF, SYNC, and Device Config
        1. 9.7.3.1  VCO_MUX, OSCout_MUX, OSCout_FMT
        2. 9.7.3.2  SYSREF_CLKin0_MUX, SYSREF_MUX
        3. 9.7.3.3  SYSREF_DIV[12:8], SYSREF_DIV[7:0]
        4. 9.7.3.4  SYSREF_DDLY[12:8], SYSREF_DDLY[7:0]
        5. 9.7.3.5  SYSREF_PULSE_CNT
        6. 9.7.3.6  PLL2_NCLK_MUX, PLL1_NCLK_MUX, FB_MUX, FB_MUX_EN
        7. 9.7.3.7  PLL1_PD, VCO_LDO_PD, VCO_PD, OSCin_PD, SYSREF_GBL_PD, SYSREF_PD, SYSREF_DDLY_PD, SYSREF_PLSR_PD
        8. 9.7.3.8  DDLYd_SYSREF_EN, DDLYdX_EN
        9. 9.7.3.9  DDLYd_STEP_CNT
        10. 9.7.3.10 SYSREF_CLR, SYNC_1SHOT_EN, SYNC_POL, SYNC_EN, SYNC_PLL2_DLD, SYNC_PLL1_DLD, SYNC_MODE
        11. 9.7.3.11 SYNC_DISSYSREF, SYNC_DISX
        12. 9.7.3.12 Fixed Register
      4. 9.7.4 (0x146 - 0x149) CLKin Control
        1. 9.7.4.1 CLKin2_EN, CLKin1_EN, CLKin0_EN, CLKin2_TYPE, CLKin1_TYPE, CLKin0_TYPE
        2. 9.7.4.2 CLKin_SEL_POL, CLKin_SEL_MODE, CLKin1_OUT_MUX, CLKin0_OUT_MUX
        3. 9.7.4.3 CLKin_SEL0_MUX, CLKin_SEL0_TYPE
        4. 9.7.4.4 SDIO_RDBK_TYPE, CLKin_SEL1_MUX, CLKin_SEL1_TYPE
      5. 9.7.5 RESET_MUX, RESET_TYPE
      6. 9.7.6 (0x14B - 0x152) Holdover
        1. 9.7.6.1 LOS_TIMEOUT, LOS_EN, TRACK_EN, HOLDOVER_FORCE, MAN_DAC_EN, MAN_DAC[9:8]
        2. 9.7.6.2 MAN_DAC[9:8], MAN_DAC[7:0]
        3. 9.7.6.3 DAC_TRIP_LOW
        4. 9.7.6.4 DAC_CLK_MULT, DAC_TRIP_HIGH
        5. 9.7.6.5 DAC_CLK_CNTR
        6. 9.7.6.6 CLKin_OVERRIDE, HOLDOVER_PLL1_DET, HOLDOVER_LOS_DET, HOLDOVER_VTUNE_DET, HOLDOVER_HITLESS_SWITCH, HOLDOVER_EN
        7. 9.7.6.7 HOLDOVER_DLD_CNT[13:8], HOLDOVER_DLD_CNT[7:0]
      7. 9.7.7 (0x153 - 0x15F) PLL1 Configuration
        1. 9.7.7.1 CLKin0_R[13:8], CLKin0_R[7:0]
        2. 9.7.7.2 CLKin1_R[13:8], CLKin1_R[7:0]
        3. 9.7.7.3 CLKin2_R[13:8], CLKin2_R[7:0]
        4. 9.7.7.4 PLL1_N
        5. 9.7.7.5 PLL1_WND_SIZE, PLL1_CP_TRI, PLL1_CP_POL, PLL1_CP_GAIN
        6. 9.7.7.6 PLL1_DLD_CNT[13:8], PLL1_DLD_CNT[7:0]
        7. 9.7.7.7 PLL1_R_DLY, PLL1_N_DLY
        8. 9.7.7.8 PLL1_LD_MUX, PLL1_LD_TYPE
      8. 9.7.8 (0x160 - 0x16E) PLL2 Configuration
        1. 9.7.8.1 PLL2_R[11:8], PLL2_R[7:0]
        2. 9.7.8.2 PLL2_P, OSCin_FREQ, PLL2_XTAL_EN, PLL2_REF_2X_EN
        3. 9.7.8.3 PLL2_N_CAL
        4. 9.7.8.4 PLL2_FCAL_DIS, PLL2_N
        5. 9.7.8.5 PLL2_WND_SIZE, PLL2_CP_GAIN, PLL2_CP_POL, PLL2_CP_TRI
        6. 9.7.8.6 SYSREF_REQ_EN, PLL2_DLD_CNT
        7. 9.7.8.7 PLL2_LF_R4, PLL2_LF_R3
        8. 9.7.8.8 PLL2_LF_C4, PLL2_LF_C3
        9. 9.7.8.9 PLL2_LD_MUX, PLL2_LD_TYPE
      9. 9.7.9 (0x16F - 0x1FFF) Misc Registers
        1. 9.7.9.1  Fixed Register 0x171
        2. 9.7.9.2  Fixed Register 0x172
        3. 9.7.9.3  PLL2_PRE_PD, PLL2_PD
        4. 9.7.9.4  OPT_REG_1
        5. 9.7.9.5  OPT_REG_2
        6. 9.7.9.6  RB_PLL1_LD_LOST, RB_PLL1_LD, CLR_PLL1_LD_LOST
        7. 9.7.9.7  RB_PLL2_LD_LOST, RB_PLL2_LD, CLR_PLL2_LD_LOST
        8. 9.7.9.8  RB_DAC_VALUE(MSB), RB_CLKinX_SEL, RB_CLKinX_LOS
        9. 9.7.9.9  RB_DAC_VALUE
        10. 9.7.9.10 RB_HOLDOVER
        11. 9.7.9.11 SPI_LOCK
  10. 10Applications and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Digital Lock Detect Frequency Accuracy
        1. 10.1.1.1 Minimum Lock Time Calculation Example
      2. 10.1.2 Driving CLKin and OSCin Inputs
        1. 10.1.2.1 Driving CLKin Pins With a Differential Source
        2. 10.1.2.2 Driving CLKin or OSCin Pins With a Single-Ended Source
      3. 10.1.3 Using AC-Coupled Clock Outputs
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Device Selection
          1. 10.2.2.1.1 Clock Architect
          2. 10.2.2.1.2 Clock Design Tool
        2. 10.2.2.2 Device Configuration and Simulation
        3. 10.2.2.3 Device Programming
      3. 10.2.3 Application Curves
    3. 10.3 Do's and Don'ts
      1. 10.3.1 Pin Connection Recommendations
  11. 11Power Supply Recommendations
    1. 11.1 Current Consumption / Power Dissipation Calculations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Thermal Management
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
        1. 13.1.1.1 Clock Architect
        2. 13.1.1.2 Clock Design Tool
        3. 13.1.1.3 TICS Pro
      2. 13.6   Electrostatic Discharge Caution
      3. 13.7   Glossary
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • EP Features
    • Gold Bondwires
    • Temperature Range: –55 to +105 °C
    • Lead Finish SnPb
  • Maximum Distribution Frequency: 3.2 GHz
  • JESD204B Support
  • Ultra-Low RMS Jitter
    • 88-fs RMS Jitter (12 kHz to 20 MHz)
    • 91-fs RMS Jitter (100 Hz to 20 MHz)
    • –162.5 dBc/Hz Noise Floor at 245.76 MHz
  • Up to 14 Differential Device Clocks From PLL2
    • Up to 7 SYSREF Clocks
    • Maximum Clock Output Frequency 3.2 GHz
    • LVPECL, LVDS, HSDS, LCPECL Programmable Outputs From PLL2
  • Up to 1 Buffered VCXO/Crystal Output From PLL1
    • LVPECL, LVDS, 2xLVCMOS Programmable
  • Multi-Mode: Dual PLL, Single PLL, and Clock Distribution
  • Dual Loop PLLatinum™ PLL Architecture
  • PLL1
    • Up to 3 Redundant Input Clocks
      • Automatic and Manual Switchover Modes
      • Hitless Switching and LOS
    • Integrated Low-Noise Crystal Oscillator Circuit
    • Holdover Mode When Input Clocks are Lost
  • PLL2
    • Normalized [1 Hz] PLL Noise Floor of
      –227 dBc/Hz
    • Phase Detector Rate up to 155 MHz
    • OSCin Frequency-Doubler
    • Two Integrated Low-Noise VCOs
  • 50% Duty Cycle Output Divides, 1 to 32
    (Even and Odd)
  • Precision Digital Delay, Dynamically Adjustable
  • 25-ps Step Analog Delay
  • 3.15-V to 3.45-V Operation
  • Package: 64-Pin WQFN (9.0 mm × 9.0 mm × 0.8 mm)

2 Applications

  • Wireless Infrastructure
  • Data Converter Clocking
  • Networking, SONET/SDH, DSLAM
  • Medical / Video / Military / Aerospace
  • Test and Measurement

3 Description

The LMK04828-EP device is the industry's highest performance clock conditioner with JESD204B support.

The 14 clock outputs from PLL2 can be configured to drive seven JESD204B converters or other logic devices using device and SYSREF clocks. SYSREF can be provided using both DC and AC coupling. Not limited to JESD204B applications, each of the 14 outputs can be individually configured as high-performance outputs for traditional clocking systems.

The high performance combined with features like the ability to trade off between power or performance, dual VCOs, dynamic digital delay, holdover, and glitchless analog delay make the LMK04828-EP ideal for providing flexible high-performance clocking trees.

Device Information(1)

PART NUMBER VCO0 FREQUENCY VCO1 FREQUENCY
LMK04828-EP 2450 to 2755 MHz 2875 to 3080 MHz
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Simplified Schematic

LMK04828-EP g_frontpage.gif

4 Revision History

DATE REVISION NOTES
April 2017 * Initial release