SNAS888A
September 2024 – November 2024
LMK1D2102L
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Device Comparison
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Typical Characteristics
7
Parameter Measurement Information
7.1
Differential Voltage Measurement Terminology
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Output Common Mode
8.3.2
Fail-Safe Input
8.4
Device Functional Modes
8.4.1
Output Enable / Disable and Amplitude Selection
8.4.2
LVDS Output Termination
8.4.3
Input Termination
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.3
Application Curves
9.3
Power Supply Recommendations
9.4
Layout
9.4.1
Layout Guidelines
9.4.2
Layout Examples
10
Device and Documentation Support
10.1
Documentation Support
10.1.1
Related Documentation
10.2
Receiving Notification of Documentation Updates
10.3
Support Resources
10.4
Trademarks
10.5
Electrostatic Discharge Caution
10.6
Glossary
11
Revision History
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RGT|16
MPQF119H
Thermal pad, mechanical data (Package|Pins)
RGT|16
QFND098S
Orderable Information
SNAS888A_pm
snas888a_oa
9.4.2
Layout Examples
Figure 9-6
PCB Layout Example for LMK1D2104L, Top Layer
Figure 9-8
PCB Layout Example for LMK1D2106L, Top Layer
Figure 9-10
PCB Layout Example for LMK1D2108L, Top Layer
Figure 9-7
PCB Layout Example for LMK1D2104L, GND Layer
Figure 9-9
PCB Layout Example for LMK1D2106L, GND layer
Figure 9-11
PCB Layout Example for LMK1D2108L, GND Layer