SNAS829A October   2021  – January 2022 LMK1D2106 , LMK1D2108

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fail-Safe Input
    4. 8.4 Device Functional Modes
      1. 8.4.1 LVDS Output Termination
      2. 8.4.2 Input Termination
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) LMK1D2106 LMK1D2108 UNIT
RHA (VQFN) RGZ (VQFN)
40 PINS 48 PINS
RθJA Junction-to-ambient thermal resistance 30.3 30.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 21.6 21.2 °C/W
RθJB Junction-to-board thermal resistance 13.1 12.9 °C/W
ΨJT Junction-to-top characterization parameter 0.4 0.4 °C/W
ΨJB Junction-to-board characterization parameter 13 12.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 4.5 4.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.