SNAS816C March   2022  – February 2025 LMK5B33216

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Diagrams
    7. 6.7 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Differential Voltage Measurement Terminology
    2. 7.2 Output Clock Test Configurations
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
      1. 8.2.1 PLL Architecture Overview
      2. 8.2.2 DPLL
        1. 8.2.2.1 Independent DPLL Operation
        2. 8.2.2.2 Cascaded DPLL Operation
        3. 8.2.2.3 APLL Cascaded With DPLL
      3. 8.2.3 APLL-Only Mode
    3. 8.3 Feature Description
      1. 8.3.1  Oscillator Input (XO)
      2. 8.3.2  Reference Inputs
      3. 8.3.3  Clock Input Interfacing and Termination
      4. 8.3.4  Reference Input Mux Selection
        1. 8.3.4.1 Automatic Input Selection
        2. 8.3.4.2 Manual Input Selection
      5. 8.3.5  Hitless Switching
        1. 8.3.5.1 Hitless Switching With Phase Cancellation
        2. 8.3.5.2 Hitless Switching With Phase Slew Control
        3. 8.3.5.3 Hitless Switching With 1PPS Inputs
      6. 8.3.6  Gapped Clock Support on Reference Inputs
      7. 8.3.7  Input Clock and PLL Monitoring, Status, and Interrupts
        1. 8.3.7.1 XO Input Monitoring
        2. 8.3.7.2 Reference Input Monitoring
          1. 8.3.7.2.1 Reference Validation Timer
          2. 8.3.7.2.2 Frequency Monitoring
          3. 8.3.7.2.3 Missing Pulse Monitor (Late Detect)
          4. 8.3.7.2.4 Runt Pulse Monitor (Early Detect)
          5. 8.3.7.2.5 Phase Valid Monitor for 1PPS Inputs
        3. 8.3.7.3 PLL Lock Detectors
        4. 8.3.7.4 Tuning Word History
        5. 8.3.7.5 Status Outputs
        6. 8.3.7.6 Interrupt
      8. 8.3.8  PLL Relationships
        1. 8.3.8.1  PLL Frequency Relationships
          1. 8.3.8.1.1 APLL Phase Frequency Detector (PFD) and Charge Pump
          2. 8.3.8.1.2 APLL VCO Frequency
          3. 8.3.8.1.3 DPLL TDC Frequency
          4. 8.3.8.1.4 DPLL VCO Frequency
          5. 8.3.8.1.5 Clock Output Frequency
        2. 8.3.8.2  Analog PLLs (APLL1, APLL2, APLL3)
        3. 8.3.8.3  APLL Reference Paths
          1. 8.3.8.3.1 APLL XO Doubler
          2. 8.3.8.3.2 APLL XO Reference (R) Divider
        4. 8.3.8.4  APLL Feedback Divider Paths
          1. 8.3.8.4.1 APLL N Divider With Sigma-Delta Modulator (SDM)
        5. 8.3.8.5  APLL Loop Filters (LF1, LF2, LF3)
        6. 8.3.8.6  APLL Voltage-Controlled Oscillators (VCO1, VCO2, VCO3)
          1. 8.3.8.6.1 VCO Calibration
        7. 8.3.8.7  APLL VCO Clock Distribution Paths
        8. 8.3.8.8  DPLL Reference (R) Divider Paths
        9. 8.3.8.9  DPLL Time-to-Digital Converter (TDC)
        10. 8.3.8.10 DPLL Loop Filter (DLF)
        11. 8.3.8.11 DPLL Feedback (FB) Divider Path
      9. 8.3.9  Output Clock Distribution
      10. 8.3.10 Output Source Muxes
      11. 8.3.11 Output Channel Muxes
      12. 8.3.12 Output Dividers (OD)
      13. 8.3.13 SYSREF/1PPS Output
      14. 8.3.14 Output Delay
      15. 8.3.15 Clock Output Drivers
        1. 8.3.15.1 Differential Output
        2. 8.3.15.2 LVCMOS Output
      16. 8.3.16 Clock Output Interfacing and Termination
      17. 8.3.17 Glitchless Output Clock Start-Up
      18. 8.3.18 Output Auto-Mute During LOL
      19. 8.3.19 Output Synchronization (SYNC)
      20. 8.3.20 Zero-Delay Mode (ZDM)
      21. 8.3.21 DPLL Programmable Phase Delay
      22. 8.3.22 Time Elapsed Counter (TEC)
        1. 8.3.22.1 Configuring TEC Functionality
        2. 8.3.22.2 SPI as a Trigger Source
        3. 8.3.22.3 GPIO Pin as a TEC Trigger Source
          1. 8.3.22.3.1 An Example: Making a Time Elapsed Measurement Using TEC and GPIO1 as Trigger
        4. 8.3.22.4 TEC Timing
        5. 8.3.22.5 Other TEC Behavior
    4. 8.4 Device Functional Modes
      1. 8.4.1 DPLL Operating States
        1. 8.4.1.1 Free-Run
        2. 8.4.1.2 Lock Acquisition
        3. 8.4.1.3 DPLL Locked
        4. 8.4.1.4 Holdover
      2. 8.4.2 Digitally-Controlled Oscillator (DCO) Frequency and Phase Adjustment
        1. 8.4.2.1 DPLL DCO Control
        2. 8.4.2.2 DPLL DCO Relative Adjustment Frequency Step Size
        3. 8.4.2.3 APLL DCO Frequency Step Size
      3. 8.4.3 APLL Frequency Control
      4. 8.4.4 Device Start-Up
        1. 8.4.4.1 Device Power-On Reset (POR)
        2. 8.4.4.2 PLL Start-Up Sequence
        3. 8.4.4.3 Start-Up Options for Register Configuration
        4. 8.4.4.4 GPIO1 and SCS_ADD Functionalities
        5. 8.4.4.5 ROM Page Selection
        6. 8.4.4.6 ROM Detailed Description
        7. 8.4.4.7 EEPROM Overlay
    5. 8.5 Programming
      1. 8.5.1 Memory Overview
      2. 8.5.2 Interface and Control
        1. 8.5.2.1 Programming Through TICS Pro
        2. 8.5.2.2 SPI Serial Interface
        3. 8.5.2.3 I2C Serial Interface
      3. 8.5.3 General Register Programming Sequence
      4. 8.5.4 Steps to Program the EEPROM
        1. 8.5.4.1 Overview of the SRAM Programming Methods
        2. 8.5.4.2 EEPROM Programming With the Register Commit Method
        3. 8.5.4.3 EEPROM Programming With the Direct Writes Method or Mixed Method
        4. 8.5.4.4 Five MSBs of the I2C Address and the EEPROM Revision Number
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Device Start-Up Sequence
      2. 9.1.2 Power Down (PD#) Pin
      3. 9.1.3 Strap Pins for Start-Up
      4. 9.1.4 Pin States
      5. 9.1.5 ROM and EEPROM
      6. 9.1.6 Power Rail Sequencing, Power Supply Ramp Rate, and Mixing Supply Domains
        1. 9.1.6.1 Power-On Reset (POR) Circuit
        2. 9.1.6.2 Power Up From a Single-Supply Rail
        3. 9.1.6.3 Power Up From Split-Supply Rails
        4. 9.1.6.4 Non-Monotonic or Slow Power-Up Supply Ramp
      7. 9.1.7 Slow or Delayed XO Start-Up
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Best Design Practices
    4. 9.4 Power Supply Recommendations
      1. 9.4.1 Power Supply Bypassing
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
      3. 9.5.3 Thermal Reliability
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 Clock Tree Architect Programming Software
        2. 10.1.1.2 Texas Instruments Clocks and Synthesizers (TICS) Pro Software
        3. 10.1.1.3 PLLatinum™ Simulation Tool
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.2 Detailed Design Procedure

In a typical application, the following steps are recommended:

  1. Use the device GUI in the TICS Pro programming software for a step-by-step design flow to enter the design parameters, calculate the frequency plan for each PLL domain, and generate the register settings for the desired configuration. The register settings can be exported (registers hex dump in .txt format) to enable host programming.
    • A host device can program the register settings through the serial interface after power-up and issue a soft-reset (by SWRST bit) to start the device. Set SW_SYNC before, and clear after SWRST.
  2. Tie the GPIO1 pin to ground to select the I2C communications interface, or pull up GPIO1 high to VDD_DIG through an external resistor to select the SPI communications interface. Determine the logic I/O pin assignments for control and status functions. See GPIO1 and SCS_ADD Functionalities.
    • Connect I2C/SPI and logic I/O pins (1.8V compatible levels) to the host device pins with the proper I/O direction and voltage levels.
  3. Select an XO frequency by following Oscillator Input (XO).
    • Choose an XO with target phase jitter performance that meets the frequency stability and accuracy requirements required for the output clocks during free-run or holdover.
    • The LMK5B33216 can directly accept a 3.3V LVCMOS input into the XO pin.
    • Power the XO from a low-noise LDO regulator or optimize the power filtering to avoid supply noise-induced jitter on the XO clock.
    • TICS Pro: Configure the XO frequency to match the XO input.
  4. Wire the clock I/O for each APLL domain in the schematic and use TICS Pro to configure the device settings as follows:
    • Reference inputs: Follow the LVCMOS or differential clock input interface guidelines in Clock Input Interfacing and Termination.
      • TICS Pro: For DPLL mode, configure the reference input buffer modes to match the reference clock driver interface requirements. See Reference Inputs.
    • TICS Pro: For DPLL mode, configure the DPLL input selection modes and input priorities. See Reference Input Mux Selection.
    • TICS Pro: Configure each APLL reference from other VCO domain (Cascaded mode) or XO clock (Non-cascaded mode).
    • TICS Pro: Configure each output with the required clock frequency and APLL domain. TICS Pro can calculate the VCO frequencies and divider settings for the APLL and outputs. Consider the following output clock assignment guidelines to minimize crosstalk and spurs:
      • Group identical output frequencies (or harmonic frequencies) on adjacent channels and use the output pairs with a single divider (for example, OUT2/OUT3 and OUT14/OUT15) when possible to minimize power.
      • Separate clock outputs when the difference of the two frequencies, |fOUTx – fOUTy|, falls within the jitter integration bandwidth (for example, 12kHz to 20MHz). Any outputs that are potential aggressors must be separated by at least four static pins (power pin, logic pin, or disabled output pins) to minimize potential coupling. If possible, separate these clocks by the placing them on opposite output banks, which are on opposite sides of the chip for best isolation.
      • Avoid or isolate any LVCMOS output (strong aggressor) from other jitter-sensitive differential output clocks. If an LVCMOS output is required, use dual complementary LVCMOS mode (+/- or -/+) with the unused LVCMOS output left floating with no trace.
      • If not all outputs pairs are used in the application, consider connecting an unused output to a pair of RF coaxial test structures for testing purposes (such as SMA, SMP ports).
    • TICS Pro: Configure the output drivers.
    • Clock output Interfacing: Follow the single-ended or differential clock output interface guidelines in Clock Output Interfacing and Termination.
      • Differential outputs can be AC-coupled and terminated and biased at the receiver inputs, or DC-coupled with proper receivers
      • LVCMOS outputs have internal source termination to drive 50Ω traces directly. LVCMOS VOH level is determined by internal LDO programmed voltage (1.8V or 2.65V).
    • TICS Pro: Configure the DPLL loop bandwidth.
      • Below the loop bandwidth, the reference noise is added to the TDC noise floor and the XO/TCXO/OCXO noise. Above the loop bandwidth, the reference noise is attenuated with roll-off up to 60dB/decade. The optimal bandwidth depends on the relative phase noise between the reference input and the XO. The APLL loop bandwidth can be configured to provide additional attenuation of the reference input, TDC, and XO phase noise above the APLL bandwidth.
    • TICS Pro: Configure the maximum TDC frequency to optimize the DPLL TDC noise contribution for the desired use case.
      • Wired: A 400kHz maximum TDC rate is commonly specified. This supports SyncE and other use cases using a narrow loop bandwidth (≤10Hz) with a TCXO/OCXO/XO to set the frequency stability and wander performance.
      • Wireless: A 26MHz maximum TDC rate is commonly specified for lowest in-band TDC noise contribution. This supports wireless and other use cases where close-in phase noise is critical.
    • TICS Pro: If clock steering is needed (such as for IEEE-1588 PTP), enable DCO mode for the DPLL loop and enter the frequency step size (in ppb). The FDEV step register is computed according to APLL DCO Frequency Step Size. Enable the FDEV_TRIG and FDEV_DIR pin control on the GPIO pins if needed.
    • TICS Pro: If deterministic input-to-output clock phase is needed, configure ZDM for the corresponding OUTx. See Section 8.3.20.
  5. TICS Pro: Configure the reference input monitoring options for each reference input. Disable the monitor when not required or when the input operates beyond the monitor's supported frequency range. See Reference Input Monitoring.
    • Frequency monitor: Set the valid and invalid thresholds (in ppm).
    • Missing pulse monitor: Set the late window threshold (TLATE) to allow for the longest expected input clock period, including worst-case cycle-to-cycle jitter. For a gapped clock input, set TLATE based on the number of allowable missing clock pulses.
    • Runt pulse monitor: Set the early window threshold (TEARLY) to allow for the shortest expected input clock period, including worst-case cycle-to-cycle jitter.
    • 1PPS Phase validation monitor: Set the phase validation jitter threshold, including worst-case input cycle-to-cycle jitter.
    • Validation timer: Set the amount of time the reference input must be qualified by all enabled input monitors before the input is valid for selection.
  6. TICS Pro: Configure the DPLL lock detect and tuning word history monitoring options for each channel. See PLL Lock Detectors and Tuning Word History.
    • DPLL frequency lock and phase lock detectors: Set the lock and unlock thresholds for each detector.
  7. TICS Pro: Configure each status output pin and interrupt flag as needed. See Status Outputs and Interrupt.
    • Select the desired status signal selection, status polarity, and driver mode (3.3V LVCMOS or open-drain). Open-drain requires an external pullup resistor.
    • If the Interrupt is enabled and selected as a status output, configure the flag polarity and the mask bits for any interrupt source, and the combinational OR gate, as needed.
  8. Consider the following guidelines for designing the power supply:
    • Outputs with identical frequency or integer-related (harmonic) frequencies can share a common filtered power supply.
      • Example: 156.25MHz and 312.5MHz outputs on OUT5 and OUT6 can share a filtered VDDO supply, while 100MHz and 122.88MHz outputs on OUT0 and OUT3 can share a separate VDDO supply.
    • See Power Rail Sequencing, Power Supply Ramp Rate, and Mixing Supply Domains.