SNAS835 September   2022 LMK5B33414

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Diagrams
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Differential Voltage Measurement Terminology
    2. 7.2 Output Clock Test Configurations
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
      1. 8.2.1 PLL Architecture Overview
      2. 8.2.2 DPLL
        1. 8.2.2.1 Independent DPLL Operation
        2. 8.2.2.2 Cascaded DPLL Operation
        3. 8.2.2.3 APLL Cascaded With DPLL
      3. 8.2.3 APLL-Only Mode
    3. 8.3 Feature Description
      1. 8.3.1  Oscillator Input (XO)
      2. 8.3.2  Reference Inputs
      3. 8.3.3  Clock Input Interfacing and Termination
      4. 8.3.4  Reference Input Mux Selection
        1. 8.3.4.1 Automatic Input Selection
        2. 8.3.4.2 Manual Input Selection
      5. 8.3.5  Hitless Switching
        1. 8.3.5.1 Hitless Switching With Phase Cancellation
        2. 8.3.5.2 Hitless Switching With Phase Slew Control
        3. 8.3.5.3 Hitless Switching With 1-PPS Inputs
      6. 8.3.6  Gapped Clock Support on Reference Inputs
      7. 8.3.7  Input Clock and PLL Monitoring, Status, and Interrupts
        1. 8.3.7.1 XO Input Monitoring
        2. 8.3.7.2 Reference Input Monitoring
          1. 8.3.7.2.1 Reference Validation Timer
          2. 8.3.7.2.2 Frequency Monitoring
          3. 8.3.7.2.3 Missing Pulse Monitor (Late Detect)
          4. 8.3.7.2.4 Runt Pulse Monitor (Early Detect)
          5. 8.3.7.2.5 Phase Valid Monitor for 1-PPS Inputs
        3. 8.3.7.3 PLL Lock Detectors
        4. 8.3.7.4 Tuning Word History
        5. 8.3.7.5 Status Outputs
        6. 8.3.7.6 Interrupt
      8. 8.3.8  PLL Relationships
        1. 8.3.8.1  PLL Frequency Relationships
          1. 8.3.8.1.1 APLL Phase Detector Frequency
          2. 8.3.8.1.2 APLL VCO Frequency
          3. 8.3.8.1.3 DPLL TDC Frequency
          4. 8.3.8.1.4 DPLL VCO Frequency
          5. 8.3.8.1.5 Clock Output Frequency
        2. 8.3.8.2  Analog PLLs (APLL1, APLL2, APLL3)
        3. 8.3.8.3  APLL Reference Paths
          1. 8.3.8.3.1 APLL XO Doubler
          2. 8.3.8.3.2 APLL XO Reference (R) Divider
        4. 8.3.8.4  APLL Phase Frequency Detector (PFD) and Charge Pump
        5. 8.3.8.5  APLL Feedback Divider Paths
          1. 8.3.8.5.1 APLL N Divider With SDM
        6. 8.3.8.6  APLL Loop Filters (LF1, LF2, LF3)
        7. 8.3.8.7  APLL Voltage-Controlled Oscillators (VCO1, VCO2, VCO3)
          1. 8.3.8.7.1 VCO Calibration
        8. 8.3.8.8  APLL VCO Clock Distribution Paths
        9. 8.3.8.9  DPLL Reference (R) Divider Paths
        10. 8.3.8.10 DPLL Time-to-Digital Converter (TDC)
        11. 8.3.8.11 DPLL Loop Filter (DLF)
        12. 8.3.8.12 DPLL Feedback (FB) Divider Path
      9. 8.3.9  Output Clock Distribution
      10. 8.3.10 Output Channel Muxes
      11. 8.3.11 Output Dividers (OD)
      12. 8.3.12 SYSREF/1-PPS
      13. 8.3.13 Output Delay
      14. 8.3.14 Clock Outputs (OUTx_P/N)
        1. 8.3.14.1 Differential Output
        2. 8.3.14.2 LVCMOS Output
        3. 8.3.14.3 SYSREF/1-PPS Output Replication
        4. 8.3.14.4 Output Auto-Mute During LOL
      15. 8.3.15 Glitchless Output Clock Start-Up
      16. 8.3.16 Clock Output Interfacing and Termination
      17. 8.3.17 Output Synchronization (SYNC)
      18. 8.3.18 Zero-Delay Mode (ZDM)
      19. 8.3.19 Time Elapsed Counter (TEC)
        1. 8.3.19.1 Configuring TEC Functionality
        2. 8.3.19.2 SPI as a Trigger Source
        3. 8.3.19.3 GPIO Pin as a TEC Trigger Source
          1. 8.3.19.3.1 An Example: Making a Time Elapsed Measurement Using TEC and GPIO1 as Trigger
        4. 8.3.19.4 TEC Timing
        5. 8.3.19.5 Other TEC Behavior
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Start-Up
        1. 8.4.1.1 ROM Selection
        2. 8.4.1.2 EEPROM Overlay
      2. 8.4.2 DPLL Operating States
        1. 8.4.2.1 Free-Run
        2. 8.4.2.2 Lock Acquisition
        3. 8.4.2.3 DPLL Locked
        4. 8.4.2.4 Holdover
      3. 8.4.3 PLL Start-Up Sequence
      4. 8.4.4 Digitally-Controlled Oscillator (DCO) Frequency and Phase Adjustment
        1. 8.4.4.1 DPLL DCO Control
          1. 8.4.4.1.1 DPLL DCO Relative Adjustment Frequency Step Size
          2. 8.4.4.1.2 APLL DCO Frequency Step Size
      5. 8.4.5 APLL Frequency Control
      6. 8.4.6 Zero-Delay Mode Synchronization
      7. 8.4.7 DPLL Programmable Phase Delay
    5. 8.5 Programming
      1. 8.5.1 Interface and Control
      2. 8.5.2 I2C Serial Interface
        1. 8.5.2.1 I2C Block Register Transfers
      3. 8.5.3 SPI Serial Interface
        1. 8.5.3.1 SPI Block Register Transfer
      4. 8.5.4 Register Map Generation
      5. 8.5.5 General Register Programming Sequence
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Device Start-Up Sequence
      2. 9.1.2 Power Down (PD#) Pin
      3. 9.1.3 Strap Pins for Start-Up
      4. 9.1.4 Pin States
      5. 9.1.5 ROM and EEPROM
      6. 9.1.6 Power Rail Sequencing, Power Supply Ramp Rate, and Mixing Supply Domains
        1. 9.1.6.1 Power-On Reset (POR) Circuit
        2. 9.1.6.2 Powering Up From a Single-Supply Rail
        3. 9.1.6.3 Power Up From Split-Supply Rails
        4. 9.1.6.4 Non-Monotonic or Slow Power-Up Supply Ramp
      7. 9.1.7 Slow or Delayed XO Start-Up
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Do's and Don'ts
    4. 9.4 Power Supply Recommendations
      1. 9.4.1 Power Supply Bypassing
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
      3. 9.5.3 Thermal Reliability
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 Clock Tree Architect Programming Software
        2. 10.1.1.2 Texas Instruments Clocks and Synthesizers (TICS) Pro Software
        3. 10.1.1.3 PLLatinum™ Simulation Tool
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Glossary
    7. 10.7 Electrostatic Discharge Caution
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.19.2 SPI as a Trigger Source

When TEC_CNTR_EN = 1, each SCS falling edge the TEC counter will be captured to the TEC_CNTR field. Subsequent to a SPI transaction which reads from the MSB of the TEC_CNTR field, no falling edge of SCS will capture the TEC counter to the TEC_CNTR field until the LSB of the TEC_CNTR field is read.

Figure 8-33 shows when the TEC is latched during single register reads and Figure 8-34 for a multibyte read.

Figure 8-33 shows that the TEC counter is captured every falling SCS edge until TEC_CNTR MSB is read.



Figure 8-33 TEC Single Byte Read

Figure 8-34 shows that the TEC counter value can be captured and re-armed for capture during a single multibyte read, even if the first register read is not the TEC_CNTR registers.



Figure 8-34 TEC Multibyte Read