SNAS750B November   2020  – March 2021 LMK5C33216

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Diagrams
  8. Parameter Measurement Information
    1. 8.1 Differential Voltage Measurement Terminology
    2. 8.2 Output Clock Test Configurations
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
      1. 9.2.1 PLL Architecture Overview
      2. 9.2.2 DPLL
        1. 9.2.2.1 Independent DPLL Operation
        2. 9.2.2.2 Cascaded DPLL Operation
        3. 9.2.2.3 APLL Cascaded with DPLL
      3. 9.2.3 APLL-Only Mode
    3. 9.3 Feature Description
      1. 9.3.1  Oscillator Input (XO)
      2. 9.3.2  Reference Inputs
      3. 9.3.3  Clock Input Interfacing and Termination
      4. 9.3.4  Reference Input Mux Selection
        1. 9.3.4.1 Automatic Input Selection
        2. 9.3.4.2 Manual Input Selection
      5. 9.3.5  Hitless Switching
        1. 9.3.5.1 Hitless Switching with Phase Cancellation
        2. 9.3.5.2 Hitless Switching With Phase Slew Control
        3. 9.3.5.3 Hitless Switching With 1-PPS Inputs
      6. 9.3.6  Gapped Clock Support on Reference Inputs
      7. 9.3.7  Input Clock and PLL Monitoring, Status, and Interrupts
        1. 9.3.7.1 XO Input Monitoring
        2. 9.3.7.2 Reference Input Monitoring
          1. 9.3.7.2.1 Reference Validation Timer
          2. 9.3.7.2.2 Frequency Monitoring
          3. 9.3.7.2.3 Missing Pulse Monitor (Late Detect)
          4. 9.3.7.2.4 Runt Pulse Monitor (Early Detect)
          5. 9.3.7.2.5 Phase Valid Monitor for 1-PPS Inputs
        3. 9.3.7.3 PLL Lock Detectors
        4. 9.3.7.4 Tuning Word History
        5. 9.3.7.5 Status Outputs
        6. 9.3.7.6 Interrupt
      8. 9.3.8  PLL Relationships
        1. 9.3.8.1  PLL Frequency Relationships
          1. 9.3.8.1.1 APLL Phase Detector Frequency
          2. 9.3.8.1.2 APLL VCO Frequency
          3. 9.3.8.1.3 DPLL TDC Frequency
          4. 9.3.8.1.4 DPLL VCO Frequency
          5. 9.3.8.1.5 Clock Output Frequency
        2. 9.3.8.2  Analog PLLs (APLL1, APLL2, APLL3)
        3. 9.3.8.3  APLL Reference Paths
          1. 9.3.8.3.1 APLL XO Doubler
          2. 9.3.8.3.2 APLL XO Reference (R) Divider
        4. 9.3.8.4  APLL Phase Frequency Detector (PFD) and Charge Pump
        5. 9.3.8.5  APLL Feedback Divider Paths
          1. 9.3.8.5.1 APLL N Divider with SDM
        6. 9.3.8.6  APLL Loop Filters (LF1, LF2, LF3)
        7. 9.3.8.7  APLL Voltage Controlled Oscillators (VCO1, VCO2, VCO3)
          1. 9.3.8.7.1 VCO Calibration
        8. 9.3.8.8  APLL VCO Clock Distribution Paths
        9. 9.3.8.9  DPLL Reference (R) Divider Paths
        10. 9.3.8.10 DPLL Time-to-Digital Converter (TDC)
        11. 9.3.8.11 DPLL Loop Filter (DLF)
        12. 9.3.8.12 DPLL Feedback (FB) Divider Path
      9. 9.3.9  Output Clock Distribution
      10. 9.3.10 Output Channel Muxes
      11. 9.3.11 Output Dividers (OD)
      12. 9.3.12 SYSREF
      13. 9.3.13 Output Delay
      14. 9.3.14 Clock Outputs (OUTx_P/N)
        1. 9.3.14.1 Differential Output
        2. 9.3.14.2 LVCMOS Output
        3. 9.3.14.3 Output Auto-Mute During LOL
      15. 9.3.15 Glitchless Output Clock Start-Up
      16. 9.3.16 Clock Output Interfacing and Termination
      17. 9.3.17 Output Synchronization (SYNC)
      18. 9.3.18 Zero-Delay Mode (ZDM) Synchronization
      19. 9.3.19 Time of Day (ToD) Counter
        1. 9.3.19.1 Configuring ToD Functionality
        2. 9.3.19.2 SPI as a Trigger Source
        3. 9.3.19.3 GPIO Pin as a ToD Trigger Source
          1. 9.3.19.3.1 An Example: Making a time measurement using ToD and GPIO1 as trigger
        4. 9.3.19.4 ToD Timing
        5. 9.3.19.5 Other ToD Behavior
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device Start-Up
        1. 9.4.1.1 ROM Selection
        2. 9.4.1.2 EEPROM Overlay
      2. 9.4.2 DPLL Operating States
        1. 9.4.2.1 Free-Run
        2. 9.4.2.2 Lock Acquisition
        3. 9.4.2.3 DPLL Locked
        4. 9.4.2.4 Holdover
      3. 9.4.3 PLL Start-Up Sequence
      4. 9.4.4 Digitally-Controlled Oscillator (DCO) Frequency and Phase Adjustment
        1. 9.4.4.1 DPLL DCO Control
          1. 9.4.4.1.1 DPLL DCO Relative Adjustment Frequency Step Size
          2. 9.4.4.1.2 APLL DCO Frequency Step Size
      5. 9.4.5 APLL Frequency Control
      6. 9.4.6 Zero-Delay Mode Synchronization
    5. 9.5 Programming
      1. 9.5.1 Interface and Control
      2. 9.5.2 I2C Serial Interface
        1. 9.5.2.1 I2C Block Register Transfers
      3. 9.5.3 SPI Serial Interface
        1. 9.5.3.1 SPI Block Register Transfer
      4. 9.5.4 Register Map Generation
      5. 9.5.5 General Register Programming Sequence
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Device Start-Up Sequence
      2. 10.1.2 Power Down (PD#) Pin
      3. 10.1.3 Strap Pins for Start-Up
      4. 10.1.4 ROM and EEPROM
      5. 10.1.5 Power Rail Sequencing, Power Supply Ramp Rate, and Mixing Supply Domains
        1. 10.1.5.1 Power-On Reset (POR) Circuit
        2. 10.1.5.2 Powering Up From a Single-Supply Rail
        3. 10.1.5.3 Power Up From Split-Supply Rails
        4. 10.1.5.4 Non-Monotonic or Slow Power-Up Supply Ramp
      6. 10.1.6 Slow or Delayed XO Start-Up
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
    3. 10.3 Do's and Don'ts
  11. 11Power Supply Recommendations
    1. 11.1 Power Supply Bypassing
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Reliability
      1. 12.3.1 Support for PCB Temperature up to 105°C
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Glossary
    6. 13.6 Electrostatic Discharge Caution
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Output Dividers (OD)

There are one or more output dividers after each output mux. Each channel in OUT[0:1] has an individual 12-bit channel divider cascaded an optional 20-bit SYSREF divider. Each channel in OUT[2:3] and OUT[14:15] has an individual 12-bit output divider. The OUT[4:5] channel has a single 12-bit output divider cascaded an optional SYSREF divider that is similar to the OUT[6:7] channel output divider, as well as OUT[8:9], OUT[10:11] or OUT[12:13]. The output dividers are used to generate the final clock output frequency from the source selected by the output mux.

Each 12-bit channel divider (CD) can support output frequencies from 86 kHz to 1000 MHz (or up to the maximum frequency supported by the configured output driver type). It is possible to configure the PLL post-divider (P) and output channel divider (CD), bypass SYSREF divider (SD) to achieve higher clock frequencies, but the output swing of the driver may fall out of specification.

OUT4 and OUT6 can source from PLL2 VCO clock (P2) directly, bypass the output channel Mux and output dividers, and output normal swing or high swing CML clocks up to 3000 MHz.

The OUT0 or OUT1 channel combines a 12-bit output channel divider (CD) and a 20-bit SYSREF divider to support output frequencies from 1 Hz (1 PPS) to 1000 MHz. From VCO to output, the total divide value is the product of the PLL post-divider (P), output channel divider (CD)and SYSREF divider (SD) values (P × CD × SD).

Each output divider is powered from the same VDDO_x supply used for the clock output drivers. The output divider can be powered down if not used to save power. For each output group in OUT[2:3], OUT[4:5], OUT[6:7], OUT[8:9], OUT[10:11], OUT[12:13], or OUT[14:15], the output divider is automatically powered down when both output drivers are disabled. For OUT0 or OUT1 channel, the output divider is automatically powered down when its output driver is disabled.