SNAS675A October   2015  – November 2015 LMK61PD0A2

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Control
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics - Power Supply
    6. 7.6  LVPECL Output Characteristics
    7. 7.7  LVDS Output Characteristics
    8. 7.8  HCSL Output Characteristics
    9. 7.9  OE Input Characteristics
    10. 7.10 OS, FS[1:0] Input Characteristics
    11. 7.11 Frequency Tolerance Characteristics
    12. 7.12 Power-On/Reset Characteristics (VDD)
    13. 7.13 PSRR Characteristics
    14. 7.14 PLL Clock Output Jitter Characteristics
    15. 7.15 Additional Reliability and Qualification
    16. 7.16 Typical Performance Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Device Output Configurations
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Device Block-Level Description
      2. 9.3.2 Device Configuration Control
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Jitter Considerations in Serdes Systems
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Ensuring Thermal Reliability
      2. 12.1.2 Best Practices for Signal Integrity
      3. 12.1.3 Recommended Solder Reflow Profile
  13. 13Device and Documentation Support
    1. 13.1 Community Resources
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Device and Documentation Support

13.1 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.2 Trademarks

E2E is a trademark of Texas Instruments.

13.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

13.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.