SNAS826E April   2022  – April 2024 LMK6C , LMK6D , LMK6H , LMK6P

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Ordering Information
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Environmental Compliance
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Thermal Information
    7. 6.7 Electrical Characteristics
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Device Output Configurations
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bulk Acoustic Wave (BAW)
      2. 8.3.2 Device Block-Level Description
      3. 8.3.3 Function Pins
      4. 8.3.4 Clock Output Interfacing and Termination
      5. 8.3.5 Temperature Stability
      6. 8.3.6 Mechanical Robustness
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Providing Thermal Reliability
        2. 9.4.1.2 Recommended Solder Reflow Profile
      2. 9.4.2 Layout
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • High-performance differential and single-ended output Oscillator, supporting any fixed frequency within the below range:
    • LMK6D: 1MHz to 400MHz, LVDS output
    • LMK6H: 1MHz to 400MHz, HCSL output
    • LMK6P: 1MHz to 400MHz, LVPECL output
    • LMK6C: 1MHz to 200MHz, LVCMOS output
  • Ultra-low jitter:
    • LMK6D/LMK6H/LMK6P: 100fs typical / 125fs maximum RMS jitter at 156.25MHz (12kHz to 20MHz)
    • LMK6C: 350fs typical / 500fs maximum RMS jitter at 100MHz (12kHz to 20MHz)
    • LMK6H: PCIe Gen 1 to Gen 6 compliant
  • ±25ppm total frequency stability inclusive of 10 years aging and all other factors
  • Smallest industry standard DLE and DLF packages
  • Support extended industrial temperature grade:
    • LMK6P/LMK6D/LMK6H: –40°C to 85°C
    • LMK6C: –40°C to 105°C
  • Integrated LDO for robust supply noise immunity:
    • –72dBc PSRR at 500kHz ripple
  • Start-up time: < 5ms
  • Standard frequencies:
    • LVCMOS (MHz): 1, 2.04, 4, 8.192, 10, 12, 12.288, 16, 19.2, 20, 23.5, 24, 24.57, 25, 25.6, 26, 26.21, 27, 28.12, 32.768, 33.333, 40, 48, 49.15, 50, 54, 60, 65.53, 66, 74.25, 76.8, 80, 100, 108, 125, 133.330 and 156.25
    • Differential (MHz): 25, 26, 32.5, 50, 51.84, 54, 65, 76.8, 80, 100, 108, 122.88, 125, 133.330, 148.35, 148.5, 150, 155.52, 156.25, 161.1328125, 200, 312.5, and 400
  • Device can support any frequency between 1MHz to 400MHz. Contact TI representative for any frequency and samples needed