SNAS826F April   2022  – February 2025 LMK6C , LMK6D , LMK6H , LMK6P

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Ordering Information
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Environmental Compliance
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Thermal Information
    7. 6.7 Electrical Characteristics
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Device Output Configurations
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bulk Acoustic Wave (BAW)
      2. 8.3.2 Device Block-Level Description
      3. 8.3.3 Function Pins
      4. 8.3.4 Clock Output Interfacing and Termination
      5. 8.3.5 Temperature Stability
      6. 8.3.6 Mechanical Robustness
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Providing Thermal Reliability
        2. 9.4.1.2 Recommended Solder Reflow Profile
      2. 9.4.2 Layout
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.9 Typical Characteristics


LMK6C LMK6D LMK6H LMK6P Current Consumption vs Frequency (LVCMOS, 1.8V)
Figure 6-3 Current Consumption vs Frequency
(LVCMOS, 1.8V)

LMK6C LMK6D LMK6H LMK6P Current Consumption vs Frequency (LVCMOS, 3.3V)
Figure 6-5 Current Consumption vs Frequency
(LVCMOS, 3.3V)

LMK6C LMK6D LMK6H LMK6P Current Consumption vs Frequency (HCSL, 2.5V)
Figure 6-7 Current Consumption vs Frequency
(HCSL, 2.5V)

LMK6C LMK6D LMK6H LMK6P Current Consumption vs Frequency (LVPECL, 1.8V)
Figure 6-9 Current Consumption vs Frequency
(LVPECL, 1.8V)

LMK6C LMK6D LMK6H LMK6P Current Consumption vs Frequency (LVPECL, 3.3V)
Figure 6-11 Current Consumption vs Frequency
(LVPECL, 3.3V)

LMK6C LMK6D LMK6H LMK6P Current Consumption vs Frequency (LVDS, 2.5V)
Figure 6-13 Current Consumption vs Frequency
(LVDS, 2.5V)

LMK6C LMK6D LMK6H LMK6P RMS Jitter vs Frequency (100MHz to 200MHz) for LVPECL, HCSL; TYPICAL 3.3V, 25°C
Figure 6-15 RMS Jitter vs Frequency (100MHz to 200MHz) for LVPECL, HCSL; TYPICAL 3.3V, 25°C

LMK6C LMK6D LMK6H LMK6P RMS Jitter vs Frequency (200MHz to 300MHz) for LVPECL, HCSL; TYPICAL 3.3V, 25°C
Figure 6-17 RMS Jitter vs Frequency (200MHz to 300MHz) for LVPECL, HCSL; TYPICAL 3.3V, 25°C

LMK6C LMK6D LMK6H LMK6P RMS Jitter vs Frequency (300MHz to 400MHz) for LVPECL, HCSL; TYPICAL 3.3V, 25°C
Figure 6-19 RMS Jitter vs Frequency (300MHz to 400MHz) for LVPECL, HCSL; TYPICAL 3.3V, 25°C

LMK6C LMK6D LMK6H LMK6P RMS Jitter vs Frequency (Below 100MHz) for LVPECL, HCSL; TYPICAL 3.3V, 25°C
Figure 6-21 RMS Jitter vs Frequency (Below 100MHz) for LVPECL, HCSL; TYPICAL 3.3V, 25°C

LMK6C LMK6D LMK6H LMK6P RMS Jitter vs Frequency ( 100MHz - 200MHz) for LVCMOS; TYPICAL 3.3V, 25°C
Figure 6-23 RMS Jitter vs Frequency ( 100MHz - 200MHz) for LVCMOS; TYPICAL 3.3V, 25°C

LMK6C LMK6D LMK6H LMK6P Duty Cycle (%) vs Frequency vs Power Supply; 25°C
Figure 6-25 Duty Cycle (%) vs Frequency vs Power Supply; 25°C

LMK6C LMK6D LMK6H LMK6P Duty Cycle (%) vs Frequency Over Temperature Range for LVCMOS; 3.3V
Figure 6-27 Duty Cycle (%) vs Frequency Over Temperature Range for LVCMOS; 3.3V

LMK6C LMK6D LMK6H LMK6P Current Consumption vs Frequency (LVCMOS, 2.5V)
Figure 6-4 Current Consumption vs Frequency
(LVCMOS, 2.5V)

LMK6C LMK6D LMK6H LMK6P Current Consumption vs Frequency (HCSL, 1.8V)
Figure 6-6 Current Consumption vs Frequency
(HCSL, 1.8V)

LMK6C LMK6D LMK6H LMK6P Current Consumption vs Frequency (HCSL, 3.3V)
Figure 6-8 Current Consumption vs Frequency
(HCSL, 3.3V)

LMK6C LMK6D LMK6H LMK6P Current Consumption vs Frequency (LVPECL, 2.5V)
Figure 6-10 Current Consumption vs Frequency
(LVPECL, 2.5V)

LMK6C LMK6D LMK6H LMK6P Current Consumption vs Frequency (LVDS, 1.8V)
Figure 6-12 Current Consumption vs Frequency
(LVDS, 1.8V)

LMK6C LMK6D LMK6H LMK6P Current Consumption vs Frequency (LVDS, 3.3V)
Figure 6-14 Current Consumption vs Frequency
(LVDS, 3.3V)

LMK6C LMK6D LMK6H LMK6P RMS Jitter vs Frequency (100MHz to 200MHz) for LVDS; TYPICAL 3.3V, 25°C
Figure 6-16 RMS Jitter vs Frequency (100MHz to 200MHz) for LVDS; TYPICAL 3.3V, 25°C

LMK6C LMK6D LMK6H LMK6P RMS Jitter vs Frequency (200MHz to 300MHz) for LVDS; TYPICAL 3.3V, 25°C
Figure 6-18 RMS Jitter vs Frequency (200MHz to 300MHz) for LVDS; TYPICAL 3.3V, 25°C

LMK6C LMK6D LMK6H LMK6P RMS Jitter vs Frequency (300MHz to 400MHz) for LVDS; TYPICAL 3.3V, 25°C
Figure 6-20 RMS Jitter vs Frequency (300MHz to 400MHz) for LVDS; TYPICAL 3.3V, 25°C

LMK6C LMK6D LMK6H LMK6P RMS Jitter vs Frequency (Below 100MHz) for LVDS; TYPICAL 3.3V, 25°C
Figure 6-22 RMS Jitter vs Frequency (Below 100MHz) for LVDS; TYPICAL 3.3V, 25°C

LMK6C LMK6D LMK6H LMK6P RMS Jitter vs Frequency ( 10MHz - 100MHz) for LVCMOS; TYPICAL 3.3V, 25°C
Figure 6-24 RMS Jitter vs Frequency ( 10MHz - 100MHz) for LVCMOS; TYPICAL 3.3V, 25°C

LMK6C LMK6D LMK6H LMK6P Duty Cycle (%) vs Temperature vs Power Supply; 50MHz Frequency
Figure 6-26 Duty Cycle (%) vs Temperature vs Power Supply; 50MHz Frequency