SNAS826E
April 2022 – April 2024
LMK6C
,
LMK6D
,
LMK6H
,
LMK6P
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Device Ordering Information
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Environmental Compliance
6.4
Recommended Operating Conditions
6.5
Thermal Information
6.6
Thermal Information
6.7
Electrical Characteristics
6.8
Timing Diagrams
6.9
Typical Characteristics
7
Parameter Measurement Information
7.1
Device Output Configurations
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Bulk Acoustic Wave (BAW)
8.3.2
Device Block-Level Description
8.3.3
Function Pins
8.3.4
Clock Output Interfacing and Termination
8.3.5
Temperature Stability
8.3.6
Mechanical Robustness
8.4
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.3
Application Curves
9.3
Power Supply Recommendations
9.4
Layout
9.4.1
Layout Guidelines
9.4.1.1
Providing Thermal Reliability
9.4.1.2
Recommended Solder Reflow Profile
9.4.2
Layout
10
Device and Documentation Support
10.1
Documentation Support
10.1.1
Related Documentation
10.2
Receiving Notification of Documentation Updates
10.3
Support Resources
10.4
Trademarks
10.5
Electrostatic Discharge Caution
10.6
Glossary
11
Revision History
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DLE|6
MPQF548B
DLF|6
MPQF547B
Thermal pad, mechanical data (Package|Pins)
DLE|6
QFND773A
DLF|6
QFND771A
Orderable Information
snas826e_oa
snas826e_pm
2
Applications
56G/112G PAM4 clocking
100G/200G/400G/800G Optical Transport Network and Coherent Optics
Network equipment, switches, routers, line cards, SAN, data centers and baseband units (BBU)
PCIe Gen 1 to Gen 6 compliant reference clock
Industrial applications
Test and measurement
ASIC, FPGA, MCU reference clocking
High-performance crystal oscillator replacement