SNAS855D November   2023  – June 2024 LMKDB1102 , LMKDB1104 , LMKDB1108 , LMKDB1120 , LMKDB1202 , LMKDB1204

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SMBus Timing Requirements
    7. 6.7 SBI Timing Requirements
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Features
        1. 8.3.1.1 Running Input Clocks When Device is Powered Off
        2. 8.3.1.2 Fail-Safe Inputs
        3. 8.3.1.3 Input Configurations
          1. 8.3.1.3.1 Internal Termination for Clock Inputs
          2. 8.3.1.3.2 AC-Coupled or DC-Coupled Clock Inputs
      2. 8.3.2 Flexible Power Sequence
        1. 8.3.2.1 PWRDN# Assertion and Deassertion
        2. 8.3.2.2 OE# Assertion and Deassertion
        3. 8.3.2.3 PWRGD Assertion
        4. 8.3.2.4 Clock Input and PWRGD/PWRDN# Behaviors When Device Power is Off
      3. 8.3.3 LOS and OE
        1. 8.3.3.1 Additional OE# Pins for LMKDB1120 and Backward Compatibility
        2. 8.3.3.2 Synchronous OE
        3. 8.3.3.3 OE Control
        4. 8.3.3.4 Automatic Output Disable
        5. 8.3.3.5 LOS Detection
      4. 8.3.4 Output Features
        1. 8.3.4.1 Output Banks
        2. 8.3.4.2 Double Termination
        3. 8.3.4.3 Programmable Output Slew Rate
          1. 8.3.4.3.1 Slew Rate Control through Pin
          2. 8.3.4.3.2 Slew Rate Control through SMBus
        4. 8.3.4.4 Programmable Output Swing
        5. 8.3.4.5 Accurate Output Impedance
        6. 8.3.4.6 Programmable Output Impedance
    4. 8.4 Device Functional Modes
      1. 8.4.1 SMBus Mode
      2. 8.4.2 SBI Mode
      3. 8.4.3 Pin Mode
  10. 9 Register Maps
    1. 9.1 LMKDB1120 Registers
    2. 9.2 LMKDB1108 Registers
    3. 9.3 LMKDB1104 Registers
    4. 9.4 LMKDB1204 Registers
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • LP-HCSL clock buffer and clock MUX that support:
    • PCIe Gen 1 to Gen 6
    • CC (Common Clock) and IR (Independent Reference) PCIe architectures
    • Input clock with or without SSC
  • DB2000QL compliant:
    • All devices meet DB2000QL specifications
    • LMKDB1120 is pin-compatible to DB2000QL
  • Extremely low additive jitter:
    • 31fs maximum 12kHz to 20MHz RMS additive jitter at 156.25MHz
    • 13fs maximum additive jitter for PCIe Gen 4
    • 5fs maximum additive jitter for PCIe Gen 5
    • 3fs maximum additive jitter for PCIe Gen 6
  • Fail-safe input
  • Flexible power-up sequence
  • Automatic output disable
  • Individual output enable
  • SBI (Side Band Interface) for high-speed output enable or disable
  • LOS (Loss of Signal) input detection
  • 85Ω or 100Ω output impedance
  • 1.8V / 3.3V ± 10% power supply
  • –40°C to 105°C ambient temperature