SNOSA71L October   2004  – September 2015 LMP2011 , LMP2012

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information: LMP2011
    5. 6.5  Thermal Information: LMP2012
    6. 6.6  2.7-V DC Electrical Characteristics
    7. 6.7  2.7-V AC Electrical Characteristics
    8. 6.8  5-V DC Electrical Characteristics
    9. 6.9  5-V AC Electrical Characteristics
    10. 6.10 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 How the LMP201x Works
      2. 7.3.2 The Benefits of LMP201x: No 1/F Noise
      3. 7.3.3 No External Capacitors Required
      4. 7.3.4 Copper Leadframe
      5. 7.3.5 More Benefits
    4. 7.4 Device Functional Modes
      1. 7.4.1 Input Currents
      2. 7.4.2 Overload Recovery
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Extending Supply Voltages and Output Swing with a Composite Amplifier
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Results
      2. 8.2.2 Precision Strain-gauge Amplifier
      3. 8.2.3 ADC Input Amplifier
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from K Revision (March 2013) to L Revision

  • Added Pin Configuration and Functions section, Storage Conditions table, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from J Revision (March 2013) to K Revision

  • Changed layout of National Data Sheet to TI formatGo