SNOSDB6D December   2020  – October 2024 LMP7704-SP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics VS = 5 V
    6. 5.6 Electrical Characteristics VS = 10 V
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Radiation Hardened Performance
      2. 6.3.2 Engineering Model (Devices With /EM Suffix)
      3. 6.3.3 Diodes Between the Inputs
      4. 6.3.4 Capacitive Load
      5. 6.3.5 Input Capacitance
    4. 6.4 Device Functional Modes
      1. 6.4.1 Precision Current Source
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Low Input Voltage Noise
      2. 7.1.2 Total Noise Contribution
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • HBH|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision C (March 2022) to Revision D (October 2024)

  • Changed description of SEL characteristics from "SEL immune" to "SEL resilient" in Features; see also Radiation Hardened Performance Go
  • Updated Device Information table notes for clarityGo
  • Changed LID pin description to clarify connections between thermal pad, metal lid, and device substrate in Pin Functions tableGo
  • Updated table note 1 in Absolute Maximum Ratings Go
  • Changed differential voltage parameter to input differential voltage, per channel, added clarifying table note, changed maximum value from (V+) – (V–) + 0.3 to 0.3 V, and added minimum value of –0.3 V, in Absolute Maximum Ratings Go
  • Added "flight model post-HDR exposure" condition, with minimum value of 82dB, to "power-supply rejection ratio"Go
  • Added "flight model post-TID exposure" condition, with maximum value of ±400 pA, to "input bias current"Go
  • Added table note to "common-mode voltage", clarifying input differential voltage limitationsGo
  • Added "flight model post-HDR exposure" condition, with minimum value of 82 dB, to "power-supply rejection ratio"Go
  • Added "flight model post-TID exposure" condition, with maximum value of ±400 pA, to "input bias current"Go
  • Added table note to "common-mode voltage", clarifying input differential voltage limitations, and added "TA = –55°C to +125°C" conditionGo
  • Changed description of TID RLAT levels from 30-krad, 50-krad, and 100-krad, to 100-krad(Si) in Radiation Hardened Performance Go
  • Changed description of NDD test levels from 15 units irradiated up to 1 × 1012 n/cm2, to 12 units irradiated up to 1 × 1013 n/cm2, and summarized test results in Radiation Hardened Performance Go
  • Added discussion of application-specific SEE concerns in Radiation Hardened Performance Go
  • Changed decoupling capacitor guidance from "10-nF to 1-µF" to "1nF to 100nF" in Power Supply Recommendations Go
  • Added text discussing bulk decoupling capacitance isolation for SEE-mitigation in Power Supply Recommendations Go
  • Added guidance regarding power pad and lid metalization to Layout Guidelines Go
  • Deleted "LMP7704-SP Example Layout for a Single Channel" figure, and replaced with "LMP7704-SP Example Layout" figure, in Layout Example Go
  • Added "LMP7704-SP Supply Decoupling Capacitance Example Layout" figure in Layout Example Go
  • Added Related Documentation sectionGo
  • Deleted outdated and incorrect HBH0014A package outline drawing from Mechanical, Packaging, and Orderable Information Go

Changes from Revision B (September 2021) to Revision C (March 2022)

  • Changed 5962R1920601VXC Flight Model from preview to production data (active)Go
  • Deleted obsolete 5962-1920601VXC, Flight Model from Device Information tableGo

Changes from Revision A (January 2021) to Revision B (September 2021)

  • Changed device from advanced information (preview) to production data (active)Go