SNVSAL6A July   2016  – February 2017 LMP8480-Q1 , LMP8481-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Theory of Operation
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1  Basic Connections
      2. 8.3.2  Selection of the Sense Resistor
      3. 8.3.3  Using PCB Traces as Sense Resistors
      4. 8.3.4  VREFA and VREFB Pins (LMP8481-Q1 Only)
        1. 8.3.4.1 One-to-One (1:1) Reference Input
        2. 8.3.4.2 Setting Output to One-Half VCC or external VREF
      5. 8.3.5  Reference Input Voltage Limits (LMP8481-Q1 Only)
      6. 8.3.6  Low-Side Current Sensing
      7. 8.3.7  Input Series Resistance
      8. 8.3.8  Minimum Output Voltage
      9. 8.3.9  Swinging Output Below Ground
      10. 8.3.10 Maximum Output Voltage
    4. 8.4 Device Functional Modes
      1. 8.4.1 Unidirectional vs Bidirectional Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Input Common-Mode and Differential Voltage Range
    2. 9.2 Typical Applications
      1. 9.2.1 Unidirectional Application With the LMP8480-Q1
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Bidirectional Current Sensing Using the LMP8481-Q1
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
      3. 9.2.3 Typical Application With a Resistive Divider
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Decoupling
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Device Support

12.1.1 Development Support

LMP8480/1 PSPICE Model

LMP8480/1 TINA Reference Design

TINA-TI SPICE-Based Analog Simulation Program

LMP8480/1 Evaluation Boards

LMP8480/1 Evaluation Board Manual

12.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to order now.

Table 2. Related Links

PARTS PRODUCT FOLDER ORDER NOW TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
LMP8480-Q1 Click here Click here Click here Click here Click here
LMP8481-Q1 Click here Click here Click here Click here Click here

12.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

12.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.5 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.6 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.