SNOSAR2H September   2008  – April 2016 LMP8601 , LMP8601-Q1 , LMP8602 , LMP8602-Q1 , LMP8603 , LMP8603-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings: LMP860x
    3. 6.3 ESD Ratings: LMP860x-Q1
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics: VS = 3.3 V
    7. 6.7 Electrical Characteristics: VS = 5 V
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Theory of Operation
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Offset Input Pin
      2. 7.3.2 Additional Second-Order Low-Pass Filter
    4. 7.4 Device Functional Modes
      1. 7.4.1 Gain Adjustment
        1. 7.4.1.1 Reducing Gain
        2. 7.4.1.2 Increasing Gain
      2. 7.4.2 Driving Switched Capacitive Loads
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Specifying Performance
    2. 8.2 Typical Applications
      1. 8.2.1 High-Side, Current-Sensing Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Low-Side, Current-Sensing Application
      3. 8.2.3 Battery Current Monitor Application
      4. 8.2.4 Advanced Battery Charger Application
      5. 8.2.5 Current Loop Receiver Application
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Related Links
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Device Support

11.1.1 Development Support

LMP8601 TINA SPICE Model, SNOM084

TINA-TI SPICE-Based Analog Simulation Program, http://www.ti.com/tool/tina-ti

11.2 Related Links

Table 1 lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 1. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
LMP8601 Click here Click here Click here Click here Click here
LMP8601-Q1 Click here Click here Click here Click here Click here
LMP8602 Click here Click here Click here Click here Click here
LMP8602-Q1 Click here Click here Click here Click here Click here
LMP8603 Click here Click here Click here Click here Click here
LMP8603-Q1 Click here Click here Click here Click here Click here

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.