SNOSB29H November   2009  – May 2022 LMP8645 , LMP8645HV

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 2.7-V Electrical Characteristics
    6. 6.6 5-V Electrical Characteristics
    7. 6.7 12-V Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Theory of Operation
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Driving ADC
      2. 7.3.2 Applying Input Voltage With No Supply Voltage
    4. 7.4 Device Functional Modes
      1. 7.4.1 Selection of the Gain Resistor
      2. 7.4.2 Gain Range Limitations
        1. 7.4.2.1 Range 1: VCM is –2 V to 1.8 V
        2. 7.4.2.2 Range 2: VCM is 1.8 V to VS
        3. 7.4.2.3 Range 3: VCM is greater than VS
      3. 7.4.3 Selection of Sense Resistor
        1. 7.4.3.1 Resistor Power Rating and Thermal Issues
        2. 7.4.3.2 Using PCB Trace as a Sense Resistor
      4. 7.4.4 Sense Line Inputs
        1. 7.4.4.1 Effects of Series Resistance on Sense Lines
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Current Monitor Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 High Brightness LED Driver
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.6 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.