SNOSB29H November   2009  – May 2022 LMP8645 , LMP8645HV

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 2.7-V Electrical Characteristics
    6. 6.6 5-V Electrical Characteristics
    7. 6.7 12-V Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Theory of Operation
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Driving ADC
      2. 7.3.2 Applying Input Voltage With No Supply Voltage
    4. 7.4 Device Functional Modes
      1. 7.4.1 Selection of the Gain Resistor
      2. 7.4.2 Gain Range Limitations
        1. 7.4.2.1 Range 1: VCM is –2 V to 1.8 V
        2. 7.4.2.2 Range 2: VCM is 1.8 V to VS
        3. 7.4.2.3 Range 3: VCM is greater than VS
      3. 7.4.3 Selection of Sense Resistor
        1. 7.4.3.1 Resistor Power Rating and Thermal Issues
        2. 7.4.3.2 Using PCB Trace as a Sense Resistor
      4. 7.4.4 Sense Line Inputs
        1. 7.4.4.1 Effects of Series Resistance on Sense Lines
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Current Monitor Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 High Brightness LED Driver
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision G (September 2015) to Revision H (May 2022)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Removed Absolute Maximum Ratings tablenote: If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and specifications.Go

Changes from Revision F (March 2013) to Revision G (September 2015)

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go

Changes from Revision E (March 2013) to Revision F (March 2013)

  • Changed layout of National Data Sheet to TI formatGo