SNAS506I January   2011  – December 2014 LMP91000

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Potentiostat Circuitry
        1. 7.3.1.1 Transimpedance Amplifier
        2. 7.3.1.2 Control Amplifier
        3. 7.3.1.3 Variable Bias
        4. 7.3.1.4 Internal Zero
        5. 7.3.1.5 Temperature Sensor
        6. 7.3.1.6 Gas Sensor Interface
          1. 7.3.1.6.1 3-Lead Amperometric Cell in Potentiostat Configuration
          2. 7.3.1.6.2 2-Lead Galvanic Cell In Ground Referred Configuration
          3. 7.3.1.6.3 2-lead Galvanic Cell in Potentiostat Configuration
        7. 7.3.1.7 Timeout Feature
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 I2C Interface
      2. 7.5.2 Write and Read Operation
    6. 7.6 Registers Maps
      1. 7.6.1 STATUS -- Status Register (Address 0x00)
      2. 7.6.2 LOCK -- Protection Register (Address 0x01)
      3. 7.6.3 TIACN -- TIA Control Register (Address 0x10)
      4. 7.6.4 REFCN -- Reference Control Register (Address 0x11)
      5. 7.6.5 MODECN -- Mode Control Register (Address 0x12)
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Connection of More Than One LMP91000 to the I2C BUS
      2. 8.1.2 Smart Gas Sensor Analog Front-End
      3. 8.1.3 Smart Gas Sensor AFES on I2C BUS
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Sensor Test Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
    1. 9.1 Power Consumption
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from H Revision (March 2013) to I Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from G Revision (March 2013) to H Revision

  • Changed layout of National Data Sheet to TI formatGo