SNIS163B April   2012  – October 2015 LMP91002

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface
    7. 6.7 Timing Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Potentiostat Circuitry
      2. 7.3.2 Transimpedance Amplifier
      3. 7.3.3 Control Amplifier
      4. 7.3.4 Internal Zero
      5. 7.3.5 2-Lead Galvanic Cell in Potentiostat Configuration
    4. 7.4 Device Functional Modes
      1. 7.4.1 Timeout Feature
    5. 7.5 Programming
      1. 7.5.1 I2C Interface
      2. 7.5.2 Write and Read Operation
      3. 7.5.3 Connection of More Than One LMP91002 to the I2C Bus
    6. 7.6 Register Maps
      1. 7.6.1 STATUS Register (Offset = 00h)
      2. 7.6.2 LOCK Register (Offset = 01h)
      3. 7.6.3 TIACN Register (Offset = 10h)
      4. 7.6.4 REFCN Register (Offset = 11h)
      5. 7.6.5 MODECN Register (Offset = 12h)
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Gas Sensor Interface
        1. 8.1.1.1 3-Lead Amperometric Cell In Potentiostat Configuration
      2. 8.1.2 Sensor Test Procedure
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Smart Gas Sensor Analog Front End
        2. 8.2.2.2 Smart Gas Sensor AFES on I2C Bus
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Consumption
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.2 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.