SNIS163B April   2012  – October 2015 LMP91002

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface
    7. 6.7 Timing Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Potentiostat Circuitry
      2. 7.3.2 Transimpedance Amplifier
      3. 7.3.3 Control Amplifier
      4. 7.3.4 Internal Zero
      5. 7.3.5 2-Lead Galvanic Cell in Potentiostat Configuration
    4. 7.4 Device Functional Modes
      1. 7.4.1 Timeout Feature
    5. 7.5 Programming
      1. 7.5.1 I2C Interface
      2. 7.5.2 Write and Read Operation
      3. 7.5.3 Connection of More Than One LMP91002 to the I2C Bus
    6. 7.6 Register Maps
      1. 7.6.1 STATUS Register (Offset = 00h)
      2. 7.6.2 LOCK Register (Offset = 01h)
      3. 7.6.3 TIACN Register (Offset = 10h)
      4. 7.6.4 REFCN Register (Offset = 11h)
      5. 7.6.5 MODECN Register (Offset = 12h)
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Gas Sensor Interface
        1. 8.1.1.1 3-Lead Amperometric Cell In Potentiostat Configuration
      2. 8.1.2 Sensor Test Procedure
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Smart Gas Sensor Analog Front End
        2. 8.2.2.2 Smart Gas Sensor AFES on I2C Bus
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Consumption
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from A Revision (March 2013) to B Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go

Changes from * Revision (March 2013) to A Revision

  • Changed layout of National Data Sheet to TI formatGo