SNAS633A March   2014  – September  2014 LMP93601

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Thermopile Array System Diagram
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Recommended Operating Conditions
    3. 7.3 Thermal Information
    4. 7.4 Electrical Characteristics
    5. 7.5 Timing Requirements
    6. 7.6 Noise Performance
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Data Format
      2. 8.3.2  Transfer Function
      3. 8.3.3  Input Routing Mux
      4. 8.3.4  Programmable Gain Amplifier
      5. 8.3.5  PGA Bypass Mode
      6. 8.3.6  Over-Range Detection
      7. 8.3.7  Analog-To-Digital Converter (ADC)
      8. 8.3.8  Programmable Digital Filters
      9. 8.3.9  Common Mode Voltage Generator
      10. 8.3.10 Low Drop-Out Regulator (LDO)
      11. 8.3.11 External Clock
      12. 8.3.12 Operating Modes
      13. 8.3.13 Data Ready Function (DRDYB)
      14. 8.3.14 Synchronous Serial Peripheral Interface (SPI)
      15. 8.3.15 Power Management Mode; Standby, Conversion and Shutdown
      16. 8.3.16 Power-On Sequence and Reset (POR) Function
      17. 8.3.17 Brown-Out Detection Function
      18. 8.3.18 Reset Function
    4. 8.4 Device Functional Modes
      1. 8.4.1 Single-Shot Mode
      2. 8.4.2 Continuous Mode
    5. 8.5 Programming
      1. 8.5.1 Window to Capture Data and Status
      2. 8.5.2 Single Byte Access
    6. 8.6 Register Maps
    7. 8.7 Multi Byte Access (Auto Increment) Mode
    8. 8.8 Multi-Channel Data Read
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Trademarks

All other trademarks are the property of their respective owners.

12.2 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.3 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.