SNVS814B June   2012  – June 2019 LMR10530

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Descriptions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Ratings
    3. 6.3 Electrical Characteristics
    4. 6.4 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Frequency Foldback
      2. 7.3.2 Load Step Response
      3. 7.3.3 Output Overvoltage Protection
      4. 7.3.4 Undervoltage Lockout
      5. 7.3.5 Current Limit
      6. 7.3.6 Soft Start/Shutdown
      7. 7.3.7 Thermal Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Detailed Design Procedure
        1. 8.2.1.1 Custom Design With WEBENCH® Tools
        2. 8.2.1.2 Inductor Selection
        3. 8.2.1.3 Input Capacitor
        4. 8.2.1.4 Output Capacitor
        5. 8.2.1.5 Catch Diode
        6. 8.2.1.6 Output Voltage
        7. 8.2.1.7 Efficiency Estimation
      2. 8.2.2 Application Curve
      3. 8.2.3 Other System Examples
        1. 8.2.3.1 LMR10530X Design Example 1
        2. 8.2.3.2 LMR10530X Design Example 2
        3. 8.2.3.3 LMR10530Y Design Example 3
        4. 8.2.3.4 LMR10530Y Design Example 4
  9. 9 Layout
    1. 9.1 Layout Considerations
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Development Support
        1. 10.1.2.1 Custom Design With WEBENCH® Tools
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Community Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Electrical Characteristics

Unless otherwise specified under the Conditions column, VIN = 5 V. Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of –40°C to +125°C. Minimum and Maximum limits are ensured through test, design, or statistical correlation. Typical values represent the most likely parametric norm, and are provided for reference purposes only.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VFB Feedback Voltage WSON-10 Package 0.588 0.600 0.612 V
ΔVFB/(ΔVINxVFB) Feedback Voltage Line Regulation VIN = 3V to 5.5V 0.08 %/V
IB Feedback Input Bias Current 0.1 100 nA
UVLO Undervoltage Lockout VIN Rising 2.70 2.90 V
VIN Falling 1.85 2.35
UVLO Hysteresis 0.35 V
fSW Switching Frequency LMR10530X 1.1 1.5 1.95 MHz
LMR10530Y 2.25 3.0 3.75
DMAX Maximum Duty Cycle LMR10530X 86% 95%
LMR10530Y 80% 90%
DMIN Minimum Duty Cycle LMR10530X 5%
LMR10530Y 7%
RDS(ON) Switch On Resistance 58 90 mΩ
ICL Switch Current Limit 3.4 4.4 A
VEN_TH Enable Threshold Voltage 1.8 V
Shutdown Threshold Voltage 0.4
ISW Switch Leakage 100 nA
IEN Enable Pin Current Sink/Source 100 nA
IQ Quiescent Current (switching) LMR10530X, VFB = 0.55 3.2 5 mA
LMR10530Y, VFB = 0.55 4.3 6.5
Quiescent Current (shutdown) All Options VEN = 0V 300 nA
VFB_F FB Frequency Foldback Threshold All Options 0.32 V
fFB Foldback Frequency LMR10530X, VFB = 0V 400 kHz
LMR10530Y, VFB = 0V 800
θJA Junction to Ambient
0 LFPM Air Flow (3) 		53 °C/W
θJC Junction to Case (3) 12 °C/W
TSD Thermal Shutdown Threshold (2) Junction Temperature Rising 165 °C
TSD_HYS Thermal Shutdown Hysteresis Junction Temperature Falling 15 °C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the recommended Operating Ratings is not implied. The recommended Operating Ratings indicate conditions at which the device is functional and should not be operated beyond such conditions.
(2) Thermal shutdown occurs if the junction temperature exceeds the maximum junction temperature of the device.
(3) Applies for packages soldered directly onto a 4” × 3” 4-layer standard JEDEC board in still air.
(4) Human body model, 1.5 kΩ in series with 100 pF.
(5) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and specifications.