SNVSAH4C December   2015  – February 2018 LMR23610

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Efficiency vs Load VIN = 12 V
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fixed Frequency Peak Current Mode Control
      2. 7.3.2 Adjustable Output Voltage
      3. 7.3.3 EN/SYNC
      4. 7.3.4 VCC, UVLO
      5. 7.3.5 Minimum ON-Time, Minimum OFF-Time and Frequency Foldback at Dropout Conditions
      6. 7.3.6 Internal Compensation and CFF
      7. 7.3.7 Bootstrap Voltage (BOOT)
      8. 7.3.8 Overcurrent and Short-Circuit Protection
      9. 7.3.9 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
      3. 7.4.3 CCM Mode
      4. 7.4.4 Light Load Operation
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design With WEBENCH® Tools
        2. 8.2.2.2  Output Voltage Setpoint
        3. 8.2.2.3  Switching Frequency
        4. 8.2.2.4  Inductor Selection
        5. 8.2.2.5  Output Capacitor Selection
        6. 8.2.2.6  Feed-Forward Capacitor
        7. 8.2.2.7  Input Capacitor Selection
        8. 8.2.2.8  Bootstrap Capacitor Selection
        9. 8.2.2.9  VCC Capacitor Selection
        10. 8.2.2.10 Undervoltage Lockout Setpoint
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Compact Layout for EMI Reduction
      2. 10.1.2 Ground Plane and Thermal Considerations
      3. 10.1.3 Feedback Resistors
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DDA|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Application Curves

Unless otherwise specified the following conditions apply: VIN = 12 V, fSW = 400 kHz, L = 22 µH, COUT = 47 µF × 2, TA = 25°C.
LMR23610 waveform_03_snvsah4.png
VOUT = 5 V IOUT = 1 A fSW = 400 kHz
Figure 22. CCM Mode
LMR23610 waveform_05_snvsah4.png
VIN = 12 V VOUT = 5 V IOUT = 1 A
Figure 24. Start-Up by VIN
LMR23610 waveform_07_snvsah4.png
VIN = 12 V VOUT = 5 V
IOUT = 0.1 A to 1 A, 100 mA / μs
Figure 26. Load Transient
LMR23610 waveform_09_snvsah4.png
VOUT = 5 V IOUT = 1 A to short
Figure 28. Short Protection
LMR23610 waveform_04_snvsah4.png
VOUT = 5 V IOUT = 0 mA fSW = 400 kHz
Figure 23. PFM Mode
LMR23610 waveform_06_snvsah4.png
VIN = 12 V VOUT = 5 V IOUT = 1 A
Figure 25. Start-Up by EN
LMR23610 waveform_08_snvsah4.png
VIN = 7 V to 36 V, 2 V / μs
VOUT = 5 V IOUT = 1 A
Figure 27. Line Transient
LMR23610 waveform_10_snvsah4.png
VOUT = 5 V IOUT = short to 1 A
Figure 29. Short Recovery