SNVSAH3E February   2018  – July 2020 LMR23625

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fixed-Frequency Peak-Current-Mode Control
      2. 7.3.2 Adjustable Output Voltage
      3. 7.3.3 Enable/Sync
      4. 7.3.4 VCC, UVLO
      5. 7.3.5 Minimum ON-time, Minimum OFF-time and Frequency Foldback at Drop-out Conditions
      6. 7.3.6 Internal Compensation and CFF
      7. 7.3.7 Bootstrap Voltage (BOOT)
      8. 7.3.8 Overcurrent and Short-Circuit Protection
      9. 7.3.9 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
      3. 7.4.3 CCM Mode
      4. 7.4.4 Light Load Operation (PFM Option)
      5. 7.4.5 Light Load Operation (FPWM Option)
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design With WEBENCH® Tools
        2. 8.2.2.2  Output Voltage Setpoint
        3. 8.2.2.3  Switching Frequency
        4. 8.2.2.4  Inductor Selection
        5. 8.2.2.5  Output Capacitor Selection
        6. 8.2.2.6  Feed-forward Capacitor
        7. 8.2.2.7  Input Capacitor Selection
        8. 8.2.2.8  Bootstrap Capacitor Selection
        9. 8.2.2.9  VCC Capacitor Selection
        10. 8.2.2.10 Undervoltage Lockout Set-Point
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Compact Layout for EMI Reduction
    4. 10.4 Ground Plane and Thermal Considerations
    5. 10.5 Feedback Resistors
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DDA|8
  • DRR|12
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from Revision D (February 2018) to Revision E (July 2020)

  • Added LMZM33603 bullet to Section 1 Go
  • Updated the numbering format for tables, figures and cross-references throughout the documentGo

Changes from Revision C (June 2017) to Revision D (February 2018)

  • Changed HSOIC and WSON Input Range to 4V to 36V from 4.5V for HSOIC and 4V for WSONGo
  • Changed Programmable Logic Controller Power Supply to Factory and Building Automation System... in Applications Go
  • Deleted Multi-Function Printers and Industrial Power Supplies and reworded Applications Go
  • Changed HVAC Systems from Applications to General Purpose Wide VIN Regulation Go
  • Removing RT row on the Pin Functions Go
  • Added "2.2-µF, 16-V" for VCC pin bypass capacitor Go
  • Added PGOOD to AGND row on Absolute Maximum Ratings Go
  • Consolidating all the common EC table characteristic between HSOIC and WSON, for example Operation Input Voltage, VIN_UVLO, IEN and Mnimum turn-on time Go
  • Changed Typical Value for VIN_UVLO Rising threshold typical from 3.6-V to 3.7-V Go
  • Removing VEN = 0 V, VIN = 4.5 V to 36 V, TJ = –40°C to 125°C (HSOIC) Test ConditionGo
  • Changed the operating from "4.5-V" ... to "4-V" in Device Functional Modes Go
  • Changed from VOUT = 7 V to 36 V to VIN = 7 V to 36 V on Figure 8-9 Go

Changes from Revision B (April 2017) to Revision C (June 2017)

  • Deleted "Automotive Battery Regulation" and reworded Applications Go
  • Added details of WSON package throughout data sheet Go
  • Added Device Comparison Table Go
  • Change EN Abs Max to EN/SYNC Abs Max Go
  • Adding VCCABS Max Table Note Go
  • Updating ESD Ratings to include HSOIC and WSON Go
  • Adding PGOOD input voltageGo
  • Adding PGOOD pin current Go
  • Corrected denominator of equation 16 from "(VOUT x VOS)" to "(VOUT + VOS)" Go
  • clarified equations equation 22 and equation 23Go

Changes from Revision A (July 2016) to Revision B (April 2017)

  • Changed high side current limit to 6.2 from 6.0Go
  • Changed low side current limit to 4.2 from 4.6Go
  • Changed all the four efficiency graphs D001, D002, D003 and D004 in the Typical Characteristics sectionGo
Note: NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision * (December 2015) to Revision A (July 2016)

  • Changed from Product Preview to Production Data and added all the remaining sections.Go