SNVSAH2E December 2015 – August 2020 LMR23630
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
POWER SUPPLY (VIN PIN) | ||||||
VIN | Operation input voltage | 4 | 36 | V | ||
VIN_UVLO | Undervoltage lockout thresholds | Rising threshold | 3.3 | 3.7 | 3.9 | V |
Falling threshold | 2.9 | 3.3 | 3.5 | |||
ISHDN | Shutdown supply current | 2 | 4 | μA | ||
VEN = 0 V, VIN = 12 V, TJ = –40°C to 125°C | ||||||
IQ | Operating quiescent current (non- switching) | VIN =12 V, VFB = 1.1 V, TJ = –40°C to 125°C, PFM mode | 75 | μA | ||
ENABLE (EN/SYNC PIN) | ||||||
VEN_H | Enable rising threshold voltage | 1.4 | 1.55 | 1.7 | V | |
VEN_HYS | Enable hysteresis voltage | 0.4 | V | |||
VWAKE | Wake-up threshold | 0.4 | V | |||
IEN | Input leakage current at EN pin | VIN = 4 V to 36 V, VEN= 2 V | 10 | 100 | nA | |
nA | ||||||
VIN = 4 V to 36 V, VEN= 36 V | 1 | μA | ||||
μA | ||||||
VOLTAGE REFERENCE (FB PIN) | ||||||
VREF | Reference voltage | VIN = 4.0 V to 36 V, TJ = 25 °C | 0.985 | 1 | 1.015 | V |
VIN = 4.0 V to 36 V, TJ = –40°C to 125°C | 0.98 | 1 | 1.02 | V | ||
ILKG_FB | Input leakage current at FB pin | VFB= 1 V | 10 | nA | ||
POWER GOOD (PGOOD PIN) | ||||||
VPG_OV | Power-good flag overvoltage tripping threshold | % of reference voltage | 104% | 107% | 110% | |
VPG_UV | Power-good flag undervoltage tripping threshold | % of reference voltage | 92% | 94% | 96.5% | |
VPG_HYS | Power-good flag recovery hysteresis | % of reference voltage | 1.5% | |||
VIN_PG_MIN | Minimum VIN for valid PGOOD output | 50 μA pullup to PGOOD pin, VEN = 0 V, TJ = 25°C | 1.5 | V | ||
VPG_LOW | PGOOD low level output voltage | 50 μA pullup to PGOOD pin, VIN = 1.5 V, VEN = 0 V | 0.4 | V | ||
0.5 mA pullup to PGOOD pin, VIN = 13.5 V, VEN = 0 V | 0.4 | V | ||||
INTERNAL LDO (VCC PIN) | ||||||
VCC | Internal LDO output voltage | 4.1 | V | |||
VCC_UVLO | VCC undervoltage lockout thresholds | Rising threshold | 2.8 | 3.2 | 3.6 | V |
Falling threshold | 2.4 | 2.8 | 3.2 | |||
CURRENT LIMIT | ||||||
IHS_LIMIT | Peak inductor current limit | HSOIC package | 3.8 | 5 | 6.2 | A |
WSON package | 4 | 5.5 | 6.6 | |||
ILS_LIMIT | Valley inductor current limit | HSOIC package | 2.9 | 3.6 | 4.6 | A |
WSON package | 2.9 | 3.6 | 4.2 | |||
IL_ZC | Zero cross current limit | HSOIC and WSON package | –0.04 | A | ||
IL_NEG | Negative current limit (FPWM option) | SOIC and WSON package | –2.7 | –2 | –1.3 | A |
INTEGRATED MOSFETS | ||||||
RDS_ON_HS | High-side MOSFET ON-resistance | SOIC package, VIN = 12 V, IOUT = 1 A | 185 | mΩ | ||
WSON package, VIN = 12 V, IOUT = 1 A | 160 | |||||
RDS_ON_LS | Low-side MOSFET ON-resistance | SOIC package, VIN = 12 V, IOUT = 1 A | 105 | mΩ | ||
WSON package, VIN = 12 V, IOUT = 1 A | 95 | |||||
THERMAL SHUTDOWN | ||||||
TSHDN | Thermal shutdown threshold | 162 | 170 | 178 | °C | |
THYS | Hysteresis | 15 | °C |