SNVSB26C June   2018  – October 2020 LMR33630-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Characteristics
    7. 6.7 System Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power-Good Flag Output
      2. 7.3.2 Enable and Start-up
      3. 7.3.3 Current Limit and Short Circuit
      4. 7.3.4 Undervoltage Lockout and Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Auto Mode
      2. 7.4.2 Dropout
      3. 7.4.3 Minimum Switch On-Time
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design With WEBENCH® Tools
        2. 8.2.2.2  Choosing the Switching Frequency
        3. 8.2.2.3  Setting the Output Voltage
        4. 8.2.2.4  Inductor Selection
        5. 8.2.2.5  Output Capacitor Selection
        6. 8.2.2.6  Input Capacitor Selection
        7. 8.2.2.7  CBOOT
        8. 8.2.2.8  VCC
        9. 8.2.2.9  CFF Selection
        10. 8.2.2.10 External UVLO
        11. 8.2.2.11 Maximum Ambient Temperature
      3. 8.2.3 Application Curves
    3. 8.3 What to Do and What Not to Do
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Ground and Thermal Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Support Resources
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RNX|12
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4.2 Dropout

The dropout performance of any buck regulator is affected by the RDSON of the power MOSFETs, the DC resistance of the inductor, and the maximum duty cycle that the controller can achieve. As the input voltage level approaches the output voltage, the off-time of the high-side MOSFET starts to approach the minimum value (see Section 6.6). Beyond this point, the switching can become erratic, and the output voltage falls out of regulation. To avoid this problem, the LMR33630-Q1 automatically reduces the switching frequency to increase the effective duty cycle and maintain regulation. In this data sheet, the dropout voltage is defined as the difference between the input and output voltage when the output has dropped by 1% of its nominal value. Under this condition, the switching frequency has dropped to its minimum value of about 140 kHz. Note that the 0.4 V short circuit detection threshold is not activated when in dropout mode. Typical dropout characteristics can be found in Figure 7-9, Figure 7-10, Figure 7-11, and Figure 7-12.

GUID-3FF805A2-F798-4693-A89C-1127B8BD0614-low.pngFigure 7-9 Overall Dropout Characteristic VOUT = 5 V
GUID-99C842BD-3B4B-4AA6-804F-398FCF43FBE6-low.pngFigure 7-11 Typical Switching Frequency in Dropout Mode VOUT = 3.3 V, fSW = 2.1 MHz
GUID-9739C0AC-5A29-4ADB-B023-62F6CCC4078E-low.pngFigure 7-10 Typical Dropout Voltage versus Output Current in Frequency Foldback ƒSW = 140 kHz
GUID-D086EF7A-D0DA-44DD-A780-A92DC766A3E2-low.pngFigure 7-12 Typical Switching Frequency in Dropout Mode VOUT = 5 V, fSW = 2.1 MHz