SNVSAN3F August   2017  – November 2020 LMR33630

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Characteristics
    7. 7.7 System Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power-Good Flag Output
      2. 8.3.2 Enable and Start-up
      3. 8.3.3 Current Limit and Short Circuit
      4. 8.3.4 Undervoltage Lockout and Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Auto Mode
      2. 8.4.2 Dropout
      3. 8.4.3 Minimum Switch On-Time
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Custom Design With WEBENCH® Tools
        2. 9.2.2.2  Choosing the Switching Frequency
        3. 9.2.2.3  Setting the Output Voltage
        4. 9.2.2.4  Inductor Selection
        5. 9.2.2.5  Output Capacitor Selection
        6. 9.2.2.6  Input Capacitor Selection
        7. 9.2.2.7  CBOOT
        8. 9.2.2.8  VCC
        9. 9.2.2.9  CFF Selection
        10. 9.2.2.10 External UVLO
        11. 9.2.2.11 Maximum Ambient Temperature
      3. 9.2.3 Application Curves
    3. 9.3 What to Do and What Not to Do
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Ground and Thermal Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RNX|12
  • DDA|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.3 What to Do and What Not to Do

  • Don't: Exceed the Absolute Maximum Ratings.
  • Don't: Exceed the ESD Ratings.
  • Don't: Exceed the Recommended Operating Conditions.
  • Don't: Allow the EN input to float.
  • Don't: Allow the output voltage to exceed the input voltage, nor go below ground.
  • Don't: Use the value of RθJA given in the table to design your application. Use the information in Section 9.2.2.11.
  • Do: Follow all the guidelines and suggestions found in this data sheet before committing the design to production. TI application engineers are ready to help critique your design and PCB layout to help make your project a success (see Support Resources).