SNVSAN3F August   2017  – November 2020 LMR33630

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Characteristics
    7. 7.7 System Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power-Good Flag Output
      2. 8.3.2 Enable and Start-up
      3. 8.3.3 Current Limit and Short Circuit
      4. 8.3.4 Undervoltage Lockout and Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Auto Mode
      2. 8.4.2 Dropout
      3. 8.4.3 Minimum Switch On-Time
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Custom Design With WEBENCH® Tools
        2. 9.2.2.2  Choosing the Switching Frequency
        3. 9.2.2.3  Setting the Output Voltage
        4. 9.2.2.4  Inductor Selection
        5. 9.2.2.5  Output Capacitor Selection
        6. 9.2.2.6  Input Capacitor Selection
        7. 9.2.2.7  CBOOT
        8. 9.2.2.8  VCC
        9. 9.2.2.9  CFF Selection
        10. 9.2.2.10 External UVLO
        11. 9.2.2.11 Maximum Ambient Temperature
      3. 9.2.3 Application Curves
    3. 9.3 What to Do and What Not to Do
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Ground and Thermal Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RNX|12
  • DDA|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.7 System Characteristics

The following specifications apply to a typical applications circuit, with nominal component values. Specifications in the typical (TYP) column apply to TJ = 25°C only. Specifications in the minimum (MIN) and maximum (MAX) columns apply to the case of typical components over the temperature range of TJ = –40°C to 125°C. These specifications are not ensured by production testing. 
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Operating input voltage range VOUT = 3.3 V, IOUT= 0 A 3.8 36 V
VOUT Output voltage regulation for VOUT = 5 V(1) VOUT = 5 V, VIN = 7 V to 36 V, IOUT = 0 A to max. load –1.5% 2.5%
VOUT = 5 V, VIN = 7 V to 36 V, IOUT = 1 A to max. load –1.5% 1.5%
Output voltage regulation for VOUT = 3.3 V(1) VOUT = 3.3 V, VIN = 3.8 V to 36 V, IOUT = 0 A to max. load –1.5% 2.5%
VOUT = 3.3 V, VIN = 3.8 V to 36 V, IOUT = 1 A to max. load –1.5% 1.5%
ISUPPLY Input supply current when in regulation VIN = 12 V, VOUT = 3.3 V, IOUT = 0 A,
RFBT = 1 MΩ		 25 µA
VDROP Dropout voltage; (VIN – VOUT) VOUT = 5 V, IOUT = 1A
Dropout at –1% of regulation,
ƒSW = 140 kHz		 150 mV
DMAX Maximum switch duty cycle(2) VIN = VOUT = 12 V, IOUT = 1 A 98%
VHC FB pin voltage required to trip short-circuit hiccup mode 0.4 V
tHC Time between current-limit hiccup burst 94 ms
tD Switch voltage dead time 2 ns
TSD Thermal shutdown temperature Shutdown temperature 165 °C
Recovery temperature 148 °C
(1) Deviation is with respect to VIN =12 V, IOUT = 1 A.
(2) In dropout the switching frequency drops to increase the effective duty cycle. The lowest frequency is clamped at approximately: ƒMIN = 1 / (tON-MAX + tOFF-MIN). DMAX = tON-MAX /(tON-MAX + tOFF-MIN).