SNVSBQ5 June   2021 LMR33620AP-Q1 , LMR33630AP-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Characteristics
    7. 7.7 System Characteristics
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power-Good Flag Output
      2. 8.3.2 Enable and Start-Up
      3. 8.3.3 Current Limit and Short Circuit
      4. 8.3.4 Undervoltage Lockout and Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Auto Mode
      2. 8.4.2 Dropout
      3. 8.4.3 Minimum Switch On Time
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Custom Design With WEBENCH® Tools
        2. 9.2.2.2  Choosing the Switching Frequency
        3. 9.2.2.3  Setting the Output Voltage
        4. 9.2.2.4  Inductor Selection
        5. 9.2.2.5  Output Capacitor Selection
        6. 9.2.2.6  Input Capacitor Selection
        7. 9.2.2.7  CBOOT
        8. 9.2.2.8  VCC
        9. 9.2.2.9  CFF Selection
        10. 9.2.2.10 External UVLO
        11. 9.2.2.11 Maximum Ambient Temperature
      3. 9.2.3 Application Curves
    3. 9.3 What to Do and What Not to Do
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Ground and Thermal Considerations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
        1. 12.1.2.1 Custom Design With WEBENCH® Tools
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Support Resources
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Design Requirements

Table 9-1 provides the parameters for our detailed design procedure example:

Table 9-1 Detailed Design Parameters
DESIGN PARAMETEREXAMPLE VALUE
Input voltage12 V (6 V to 36 V)
Output voltage5 V
Maximum output current0 A to 3 A
Switching frequency400 kHz
Table 9-2 Typical External Component Values
ƒSW (kHz) VOUT (V) L (µH) COUT (RATED CAPACITANCE) RFBT (Ω) RFBB (Ω) CIN + CHF CBOOT CVCC CFF
400 3.3 6.8 4 × 22 µF 100 k 43.2 k 10 µF + 220 nF 100 nF 1 µF open
2100 3.3 1.2 2 × 22 µF 100 k 43.2 k 10 µF + 220 nF 100 nF 1 µF open
400 5 8 4 × 22 µF 100 k 24.9 k 10 µF + 220 nF 100 nF 1 µF open
2100 5 1.5 2 × 22 µF 100 k 24.9 k 10 µF + 220 nF 100 nF 1 µF open
400 12 15 4 × 22 µF 100 k 9.09 k 10 µF + 220 nF 100 nF 1 µF open
2100 12 3.3 4 × 10 µF 100 k 9.09 k 10 µF + 220 nF 100 nF 1 µF open