SNVSBA8A May   2019  – October 2019 LMR34206-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1. 3.1 Simplified Schematic
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 System Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power-Good Flag Output
      2. 8.3.2 Enable and Start-up
      3. 8.3.3 Current Limit and Short Circuit
      4. 8.3.4 Undervoltage Lockout and Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Auto Mode
      2. 8.4.2 Forced PWM Operation
      3. 8.4.3 Dropout
      4. 8.4.4 Minimum Switch On-Time
      5. 8.4.5 Spread Spectrum Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Choosing the Switching Frequency
        2. 9.2.2.2 Setting the Output Voltage
        3. 9.2.2.3 Inductor Selection
        4. 9.2.2.4 Output Capacitor Selection
        5. 9.2.2.5 Input Capacitor Selection
        6. 9.2.2.6 CBOOT
        7. 9.2.2.7 VCC
        8. 9.2.2.8 External UVLO
        9. 9.2.2.9 Maximum Ambient Temperature
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Ground and Thermal Considerations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.7 System Characteristics

The following specifications apply to a typical application circuit with nominal component values. Specifications in the typical (TYP) column apply to TJ = 25℃ only. Specifications in the minimum (MIN) and maximum (MAX) columns apply to the case of typical components over the temperature range of TJ = –40℃ to 150℃. These specifications are not ensured by production testing.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Operating input voltage range 4.2 42 V
VOUT Voltage regulation for VOUT = 3.3 V fixed(1) FPWM operation 3.28 3.33 3.37 V
ISUPPLY Input supply current when in regulation VIN = 12 V, VOUT = 3.3 V Fixed, PFM variant 26 µA
DMAX Maximum switch duty cycle(2) 98%
VHC FB pin voltage required to trip short-circuit hiccup mode 0.4 V
tHC Time between current-limit hiccup burst 94 ms
tD Switch voltage dead time 2 ns
FsSS Frequency span of spread spectrum operation ±4 %
FrSS Triangular spread spectrum repetition frequency 16 kHz
TSD Thermal shutdown temperature Shutdown temperature 170 °C
TSD Thermal shutdown temperature Recovery temperature 158 °C
(1) Deviation in VOUT from nominal output voltage value at VIN = 24 V, IOUT = 0 A to 0.6A
(2) In dropout the switching frequency drops to increase the effective duty cycle. The lowest frequency is clamped at approximately: FMIN = 1 / (tON-MAX + tOFF-MIN). DMAX = tON-MAX /(tON-MAX + tOFF-MIN).