SNVSAY7D August   2018  – August 2022 LMR36006-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 System Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power-Good Flag Output
      2. 8.3.2 Enable and Start-up
      3. 8.3.3 Current Limit and Short Circuit
      4. 8.3.4 Undervoltage Lockout and Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Auto Mode
      2. 8.4.2 Forced PWM Operation
      3. 8.4.3 Dropout
      4. 8.4.4 Minimum Switch On-Time
      5. 8.4.5 Spread Spectrum Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design 1: Low Power 24-V, 600-mA PFM Converter
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1  Custom Design With WEBENCH Tools
          2. 9.2.1.2.2  Choosing the Switching Frequency
          3. 9.2.1.2.3  Setting the Output Voltage
            1. 9.2.1.2.3.1 FB for Adjustable Output
          4. 9.2.1.2.4  Inductor Selection
          5. 9.2.1.2.5  Output Capacitor Selection
          6. 9.2.1.2.6  Input Capacitor Selection
          7. 9.2.1.2.7  CBOOT
          8. 9.2.1.2.8  VCC
          9. 9.2.1.2.9  CFF Selection
            1. 9.2.1.2.9.1 External UVLO
          10. 9.2.1.2.10 Maximum Ambient Temperature
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Design 2: High Density 12-V , 600-mA FPWM Converter
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
    3. 9.3 What to Do and What Not to Do
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Ground and Thermal Considerations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 Custom Design With WEBENCH® Tools
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12.5 Trademarks

HotRod™ and TI E2E™ are trademarks of Texas Instruments.

WEBENCH® is a registered trademark of Texas Instruments.

All trademarks are the property of their respective owners.