SNVSBB6B December   2019  – December 2022 LMR36506

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD (Commercial) Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Characteristics
    7. 7.7 Switching Characteristics
    8. 7.8 System Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Enable, Start-up, and Shutdown
      2. 8.3.2  Adjustable Switching Frequency (with RT)
      3. 8.3.3  Power-Good Output Operation
      4. 8.3.4  Internal LDO, VCC UVLO, and VOUT/BIAS Input
      5. 8.3.5  Bootstrap Voltage and VCBOOT-UVLO (CBOOT Terminal)
      6. 8.3.6  Output Voltage Selection
      7. 8.3.7  Soft Start and Recovery from Dropout
        1. 8.3.7.1 Recovery from Dropout
      8. 8.3.8  Current Limit and Short Circuit
      9. 8.3.9  Thermal Shutdown
      10. 8.3.10 Input Supply Current
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Active Mode
        1. 8.4.3.1 CCM Mode
        2. 8.4.3.2 Auto Mode - Light Load Operation
          1. 8.4.3.2.1 Diode Emulation
          2. 8.4.3.2.2 Frequency Reduction
        3. 8.4.3.3 FPWM Mode - Light Load Operation
        4. 8.4.3.4 Minimum On-time (High Input Voltage) Operation
        5. 8.4.3.5 Dropout
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Choosing the Switching Frequency
        2. 9.2.2.2 Setting the Output Voltage
          1. 9.2.2.2.1 FB for Adjustable Output
        3. 9.2.2.3 Inductor Selection
        4. 9.2.2.4 Output Capacitor Selection
        5. 9.2.2.5 Input Capacitor Selection
        6. 9.2.2.6 CBOOT
        7. 9.2.2.7 VCC
        8. 9.2.2.8 CFF Selection
          1. 9.2.2.8.1 External UVLO
        9. 9.2.2.9 Maximum Ambient Temperature
      3. 9.2.3 Application Curves
    3. 9.3 Best Design Practices
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
        1. 9.5.1.1 Ground and Thermal Considerations
      2. 9.5.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.8 Current Limit and Short Circuit

The LMR36506 is protected from overcurrent conditions by cycle-by-cycle current limiting on both high-side and low-side MOSFETs.

High-side MOSFET overcurrent protection is implemented by the typical peak-current mode control scheme. The HS switch current is sensed when the HS is turned on after a short blanking time. The HS switch current is compared to either the minimum of a fixed current set point or the output of the internal error amplifier loop minus the slope compensation every switching cycle. Because the output of the internal error amplifier loop has a maximum value and slope compensation increases with duty cycle, HS current limit decreases with increased duty factor if duty factor is typically above 35%.

When the LS switch is turned on, the current going through it is also sensed and monitored. Like the high-side device, the low-side device has a turnoff commanded by the internal error amplifier loop. In the case of the low-side device, turnoff is prevented if the current exceeds this value, even if the oscillator normally starts a new switching cycle. Also like the high-side device, there is a limit on how high the turnoff current is allowed to be. This is called the low-side current limit, ILS-LIMIT (or IL-LS in Figure 8-10). If the LS current limit is exceeded, the LS MOSFET stays on and the HS switch is not to be turned on. The LS switch is turned off after the LS current falls below this limit and the HS switch is turned on again as long as at least one clock period has passed because the last time the HS device has turned on.

GUID-8D635B11-4D8D-4887-8C18-71B3F14E47D9-low.gifFigure 8-10 Current Limit Waveforms

Because the current waveform assumes values between ISC (or IL-HS in Figure 8-10) and ILS-LIMIT, the maximum output current is very close to the average of these two values unless duty factor is very high. After operating in current limit, hysteretic control is used and current does not increase as output voltage approaches zero.

If duty factor is very high, current ripple must be very low to prevent instability. Because current ripple is low, the part is able to deliver full current. The current delivered is very close to ILS-LIMIT.

GUID-EDA13F4D-8A84-4970-A6D0-CE43AA4986E9-low.gifFigure 8-11 Output Voltage versus Output Current

Under most conditions, current is limited to the average of IL-HS and IL-LS, which is approximately 1.3 times the maximum-rated current. If input voltage is low, current can be limited to approximately IL-LS. Also note that the maximum output current does not exceed the average of IL-HS and IL-LS. After the overload is removed, the part recovers as though in soft start.

GUID-E6774454-57AD-4138-B5BD-05E931AB0F50-low.gifFigure 8-12 Short-Circuit Waveform
GUID-ED0A6C9B-248B-406F-9018-8025B15D9206-low.gifFigure 8-13 Overload Output Recovery (100 mA to 750 mA)