For related documentation see the
following:
- Texas Instruments, Optimizing Transient Response of Internally
Compensated DC-DC Converters with Feedforward Capacitor
application report
- Texas Instruments, Thermal Design
by Insight not Hindsight application report
- Texas Instruments, A Guide to
Board Layout for Best Thermal Resistance for Exposed Pad
Packages application report
- Texas Instruments, Semiconductor
and IC Package Thermal Metrics application report
- Texas Instruments, Thermal Design Made Simple with LM43603 and LM43602
application report
- Texas Instruments, PowerPAD™
Thermally Enhanced Package Application Report
- Texas Instruments, PowerPAD™ Made
Easy application report
- Texas Instruments, Using New
Thermal Metrics application report
- Texas Instruments, Layout
Guidelines for Switching Power Supplies application
report
- Texas Instruments, Simple Switcher
PCB Layout Guidelines application report
- Texas Instruments, Construction
Your Power Supply- Layout Considerations seminar
- Texas Instruments, Low Radiated
EMI Layout Made Simple with LM4360x and LM4600x application
report
- Texas Instruments, AN-2162 Simple Success With Conducted EMI From
DC/DC Converters application report