SLUSEP7 December   2022 LMR51440 , LMR51450

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2.     ESD Ratings
    3. 7.2 Recommended Operating Conditions
    4. 7.3 Thermal Information
    5. 7.4 Electrical Characteristics
    6. 7.5 System Characteristics
    7. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Fixed Frequency Peak Current Mode Control
      2. 8.3.2  Adjustable Output Voltage
      3. 8.3.3  Enable
      4. 8.3.4  Switching Frequency
      5. 8.3.5  Power-Good Flag Output
      6. 8.3.6  Minimum ON-Time, Minimum OFF-Time, and Frequency Foldback
      7. 8.3.7  Bootstrap Voltage
      8. 8.3.8  Overcurrent and Short-Circuit Protection
      9. 8.3.9  Soft Start
      10. 8.3.10 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Active Mode
      3. 8.4.3 CCM Mode
      4. 8.4.4 Light-Load Operation (PFM Version)
      5. 8.4.5 Light-Load Operation (FPWM Version)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Output Voltage Set-Point
        2. 9.2.2.2 Switching Frequency
        3. 9.2.2.3 Inductor Selection
        4. 9.2.2.4 Output Capacitor Selection
        5. 9.2.2.5 Input Capacitor Selection
        6. 9.2.2.6 Bootstrap Capacitor
        7. 9.2.2.7 Undervoltage Lockout Set-Point
      3. 9.2.3 Application Curves
    3. 9.3 Best Design Practices
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
        1. 9.5.1.1 Compact Layout for EMI Reduction
        2. 9.5.1.2 Feedback Resistors
      2. 9.5.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 Custom Design With WEBENCH® Tools
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.5.1 Layout Guidelines

Layout is a critical portion of good power supply design. The following guidelines help users design a PCB with the best power conversion performance, thermal performance, and minimized generation of unwanted EMI.

  1. The input bypass capacitor CIN must be placed as close as possible to the VIN and PGND pins. Grounding for both the input and output capacitors must consist of localized top side planes that connect to the PGND pin.
  2. Minimize trace length to the FB pin net. Both feedback resistors, RFBT and RFBB, must be located close to the FB pin. If VOUT accuracy at the load is important, make sure VOUT sense is made at the load. Route VOUT sense path away from noisy nodes and preferably through a layer on the other side of a shielded layer.
  3. Use ground plane in one of the middle layers as noise shielding and heat dissipation path if possible.
  4. Make VIN, VOUT, and ground bus connections as wide as possible. This reduces any voltage drops on the input or output paths of the converter and maximizes efficiency.
  5. Provide adequate device heat-sinking. Use an array of heat-sinking vias to connect the top side ground plane to the ground plane on the bottom PCB layer. If the PCB has multiple copper layers, these thermal vias can also be connected to inner layer heat-spreading ground planes. Make sure enough copper area is used for heat-sinking to keep the junction temperature below 150°C.