SNAS872 December   2024 LMR60410

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable and Undervoltage Lockout
      2. 7.3.2 Soft Start and Recovery from Dropout
      3. 7.3.3 Frequency Selection With RT
      4. 7.3.4 MODE/SYNC Pin Control
      5. 7.3.5 Output Voltage Selection
      6. 7.3.6 Current Limit
      7. 7.3.7 Hiccup Mode
      8. 7.3.8 Power-Good Function
      9. 7.3.9 Spread Spectrum
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown
      2. 7.4.2 Active Mode
        1. 7.4.2.1 Continuous Conduction Mode (CCM)
        2. 7.4.2.2 Auto Mode Operation - Light Load Operation
        3. 7.4.2.3 FPWM Operation - Light Load Operation
        4. 7.4.2.4 Minimum On-Time
        5. 7.4.2.5 Dropout
  9. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Switching Frequency Selection
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Output Capacitor Selection
        4. 8.2.2.4 Input Capacitor Selection
        5. 8.2.2.5 Bootstrap Capacitor (CBOOT) Selection
        6. 8.2.2.6 FB Voltage Divider for Adjustable Versions
          1. 8.2.2.6.1 Feedforward Capacitor (CFF) Selection
        7. 8.2.2.7 RPU - PGOOD Pullup Resistor
      3. 8.2.3 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Ground and Thermal Plane Considerations
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.