SNAS872
December 2024
LMR60410
PRODMIX
1
1
Features
2
Applications
3
Description
4
Device Comparison Table
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Enable and Undervoltage Lockout
7.3.2
Soft Start and Recovery from Dropout
7.3.3
Frequency Selection With RT
7.3.4
MODE/SYNC Pin Control
7.3.5
Output Voltage Selection
7.3.6
Current Limit
7.3.7
Hiccup Mode
7.3.8
Power-Good Function
7.3.9
Spread Spectrum
7.4
Device Functional Modes
7.4.1
Shutdown
7.4.2
Active Mode
7.4.2.1
Continuous Conduction Mode (CCM)
7.4.2.2
Auto Mode Operation - Light Load Operation
7.4.2.3
FPWM Operation - Light Load Operation
7.4.2.4
Minimum On-Time
7.4.2.5
Dropout
8
Applications and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Switching Frequency Selection
8.2.2.2
Inductor Selection
8.2.2.3
Output Capacitor Selection
8.2.2.4
Input Capacitor Selection
8.2.2.5
Bootstrap Capacitor (CBOOT) Selection
8.2.2.6
FB Voltage Divider for Adjustable Versions
8.2.2.6.1
Feedforward Capacitor (CFF) Selection
8.2.2.7
RPU - PGOOD Pullup Resistor
8.2.3
Application Curves
8.3
Best Design Practices
8.4
Power Supply Recommendations
8.5
Layout
8.5.1
Layout Guidelines
8.5.1.1
Ground and Thermal Plane Considerations
8.5.2
Layout Example
9
Device and Documentation Support
9.1
Documentation Support
9.1.1
Related Documentation
9.2
Receiving Notification of Documentation Updates
9.3
Support Resources
9.4
Trademarks
9.5
Electrostatic Discharge Caution
9.6
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RAK|9
MPQF742C
Thermal pad, mechanical data (Package|Pins)
Orderable Information
snas872_oa
8.2.2
Detailed Design Procedure