SNVSCJ2
December 2023
LMR66410-Q1
,
LMR66420-Q1
,
LMR66430-Q1
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Device Comparison Table
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
System Characteristics
6.7
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Enable, Start-Up, and Shutdown
7.3.2
External CLK SYNC (With MODE/SYNC)
7.3.2.1
Pulse-Dependent MODE/SYNC Pin Control
7.3.3
Power-Good Output Operation
7.3.4
Internal LDO, VCC, and VOUT/FB Input
7.3.5
Bootstrap Voltage and VBOOT-UVLO (BOOT Terminal)
7.3.6
Output Voltage Selection
7.3.7
Spread Spectrum
7.3.8
Soft Start and Recovery from Dropout
7.3.8.1
Recovery from Dropout
7.3.9
Current Limit and Short Circuit
7.3.10
Thermal Shutdown
7.3.11
Input Supply Current
7.4
Device Functional Modes
7.4.1
Shutdown Mode
7.4.2
Standby Mode
7.4.3
Active Mode
7.4.3.1
CCM Mode
7.4.3.2
Auto Mode – Light Load Operation
7.4.3.2.1
Diode Emulation
7.4.3.2.2
Frequency Reduction
7.4.3.3
FPWM Mode – Light Load Operation
7.4.3.4
Minimum On-Time (High Input Voltage) Operation
7.4.3.5
Dropout
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design 1 - Automotive Synchronous Buck Regulator at 2.2 MHz
8.2.1.1
Design Requirements
8.2.1.2
Detailed Design Procedure
8.2.1.2.1
Choosing the Switching Frequency
8.2.1.2.2
Setting the Output Voltage
8.2.1.2.2.1
VOUT / FB for Adjustable Output
8.2.1.2.3
Inductor Selection
8.2.1.2.4
Output Capacitor Selection
8.2.1.2.5
Input Capacitor Selection
8.2.1.2.6
CBOOT
8.2.1.2.7
VCC
8.2.1.2.8
CFF Selection
8.2.1.2.9
External UVLO
8.2.1.2.10
Maximum Ambient Temperature
8.2.1.3
Application Curves
8.2.2
Design 2 - Automotive Synchronous Buck Regulator at 400 kHz
8.2.2.1
Design Requirements
8.2.2.2
Detailed Design Procedure
8.2.2.3
Application Curves
8.3
Best Design Practices
8.4
Power Supply Recommendations
8.5
Layout
8.5.1
Layout Guidelines
8.5.1.1
Ground and Thermal Considerations
8.5.2
Layout Example
9
Device and Documentation Support
9.1
Device Support
9.1.1
Third-Party Products Disclaimer
9.1.2
Device Nomenclature
9.2
Documentation Support
9.2.1
Related Documentation
9.3
Receiving Notification of Documentation Updates
9.4
Support Resources
9.5
Trademarks
9.6
Electrostatic Discharge Caution
9.7
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RXB|14
MPQF580B
Thermal pad, mechanical data (Package|Pins)
Orderable Information
snvscj2_oa
snvscj2_pm
8.5
Layout