SNVSCJ2 December 2023 LMR66410-Q1 , LMR66420-Q1 , LMR66430-Q1
PRODUCTION DATA
PIN | TYPE | DESCRIPTION | |
---|---|---|---|
NAME | NO. | ||
EN/UVLO | 1 | A | Enable input to regulator. High = ON, low = OFF. Can be connected directly to VIN. Do not float this pin. |
NC | 2 | — | No internal connection to device |
VIN | 3 | P | Input supply to regulator. High-quality bypass capacitors must be added directly between this pin and PGND. |
NC | 4 | — | No internal connection to device |
NC | 5 | — | No internal connection to device |
PGND | 6 | G | Power ground terminal. Connect to system ground. Connect to CIN with short, wide traces. |
SW | 7 | P | Regulator switch node. Connect to the power inductor. |
BOOT | 8 | P | Bootstrap supply voltage for internal high-side driver. An external 0.1-µF, 16-V capacitor is required between this pin and SW. |
NC | 9 | — | No internal connection to device |
VCC | 10 | A | Internal LDO output. Used as supply to internal control circuits. Do not connect to external loads. Can be used as logic supply for power-good flag. Connect a high-quality 1-µF capacitor from this pin to GND. |
VOUT/FB | 11 | A | Fixed output options and adjustable output options are available with the VOUT/FB pin variant. Connect to the output voltage node for fixed VOUT. See VOUT / FB for Adjustable Output for how to select feedback resistor divider values. See Device Comparison Table for more details. The FB function can be used to adjust the output voltage. Connect to tap point of feedback voltage divider. Do not float this pin. |
NC | 12 | — | No internal connection to device |
MODE/SYNC | 13 | A | This pin allows the user to select between PFM/FPWM mode or to synchronize to an external clock. See MODE/SYNC variant for more details.Do not float this pin. |
PG | 14 | A | Open-drain power-good flag output. Connect to suitable voltage supply through a current limiting resistor. High = power OK, low = power bad. This pin goes low when EN = low. This pin can be open or grounded when not used. |
GND/DAP | — | G | Thermal pad of the package. Must be soldered to achieve appropriate dissipation. Must be connected to GND. |
A = Analog, P = Power, G = Ground |