SNAS714C November   2016  – August 2021 LMS3635-Q1 , LMS3655-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Tables
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Thermal Information (for Device Mounted on PCB)
    6. 7.6 Electrical Characteristics
    7. 7.7 System Characteristics
    8. 7.8 Timing Requirements
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
      1. 8.2.1 Control Scheme
    3. 8.3 Feature Description
      1. 8.3.1 RESET Flag Output
      2. 8.3.2 Enable and Start-Up
      3. 8.3.3 Soft-Start Function
      4. 8.3.4 Current Limit
      5. 8.3.5 Hiccup Mode
      6. 8.3.6 Synchronizing Input
      7. 8.3.7 Undervoltage Lockout (UVLO) and Thermal Shutdown (TSD)
      8. 8.3.8 Input Supply Current
    4. 8.4 Device Functional Modes
      1. 8.4.1 AUTO Mode
      2. 8.4.2 FPWM Mode
      3. 8.4.3 Dropout
      4. 8.4.4 Spread-Spectrum Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 General Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 9.2.1.2.2 External Components Selection
            1. 9.2.1.2.2.1 Input Capacitors
            2. 9.2.1.2.2.2 Output Inductors and Capacitors
              1. 9.2.1.2.2.2.1 Inductor Selection
              2. 9.2.1.2.2.2.2 Output Capacitor Selection
          3. 9.2.1.2.3 Setting the Output Voltage
          4. 9.2.1.2.4 FB for Adjustable Output
          5. 9.2.1.2.5 VCC
          6. 9.2.1.2.6 BIAS
          7. 9.2.1.2.7 CBOOT
          8. 9.2.1.2.8 Maximum Ambient Temperature
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Fixed 5-V Output for USB-Type Applications
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Fixed 3.3-V Output
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
      4. 9.2.4 6-V Adjustable Output
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
        3. 9.2.4.3 Application Curves
    3. 9.3 Do's and Don't's
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
        1. 12.1.2.1 Custom Design With WEBENCH® Tools
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
9.2.1.2.6 BIAS

The BIAS pin is the input to the internal LDO. As detailed in Section 8.3.8, this input is connected directly to VOUT to provide the lowest possible supply current at light loads. Because this input is connected directly to the output, it must be protected from negative voltage transients. Such transients may occur when the output is shorted at the end of a long PCB trace or cable. If this is likely in a given application, then place a small resistor in series between the BIAS input and VOUT .

Size the resistor to limit the current out of the BIAS pin to < 100 mA. Values in the range of 2 Ω to 5 Ω are typically sufficient. Values greater than 5 Ω are not recommended. As a rough estimate, assume that the full negative transient appears across RBIAS and design for a current of < 100 mA. In severe cases, a Schottky diode can be placed in parallel with the output to limit the transient voltage and current.

When a resistor is used between the output and the BIAS pin, a 0.1-µF capacitor is required close to the BIAS pin. In general, TI recommends having a 0.1-µF capacitor near the BIAS pin, regardless of the presence of the resistor, unless the trace between the output capacitors and the BIAS pin is very short.

The typical current into the bias pin is 15 mA when the device is operating in PWM mode at 400 kHz.