SNOS487F May   2004  – December 2016 LMS8117A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Protection
      2. 7.3.2 Programmable Feedback
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Operation With Low Input Voltage
      3. 7.4.3 Operation at Light Loads
      4. 7.4.4 Operation in Self Protection
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Output Regulator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 External Capacitors and Stability
            1. 8.2.1.2.1.1 Input Bypass Capacitor
            2. 8.2.1.2.1.2 ADJUST Pin Bypass Capacitor
            3. 8.2.1.2.1.3 Output Capacitor
          2. 8.2.1.2.2 Output Voltage
          3. 8.2.1.2.3 Load Regulation
          4. 8.2.1.2.4 Protection Diodes
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Other Application Circuits
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
      1. 10.3.1 Heat Sink Requirements
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Maximum input voltage (all versions), VIN 20 V
Power dissipation(3) Internally limited
Junction temperature, TJ(MAX) 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications.
(3) The maximum power disspation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA) / RθJA. All numbers apply for packages soldered directly onto a PCB.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±2000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) For testing purposes, ESD was applied using human body model, 1.5-kΩ resistor in series iwth 100-pF capacitor.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Input voltage (all versions) 15 V
Junction temperature, TJ 0 125 °C

6.4 Thermal Information

THERMAL METRIC(1) LMS8117A UNIT
DCY (SOT-223) NDP (TO-252)
4 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance 61.4 56.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 43 42.8 °C/W
RθJB Junction-to-board thermal resistance 10 29.4 °C/W
ψJT Junction-to-top characterization parameter 2.4 5.4 °C/W
ψJB Junction-to-board characterization parameter 9.9 28.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — 4.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

Typical values apply for TJ = 25°C and Minimum and Maximum limits apply for TJ = 0°C to 125°C (unless otherwise noted). Typical values represent the most likely parametric norm. All limits are guaranteed using by testing or statistical analysis.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VREF Reference voltage Adjustable version IOUT = 10 mA, VIN – VOUT = 2 V, TJ = 25°C 1.238 1.25 1.262 V
IOUT = 10 mA to 1 A, VIN – VOUT = 1.4 V to 10 V 1.225 1.27
VOUT Output voltage 1.8-V version IOUT = 10 mA, VIN = 3.8 V, TJ = 25°C 1.782 1.8 1.818 V
IOUT = 0 A to 1 A, VIN = 3.2 V to 10 V 1.746 1.854
3.3-V version IOUT = 10 mA, VIN = 5 V, TJ = 25°C 3.267 3.3 3.333
IOUT = 0 A to 1 A, VIN = 4.75 V to 10 V 3.235 3.365
ΔVOUT Line regulation(1) Adjustable version, IOUT = 10 mA, VIN – VOUT = 1.5 V to 13.75 V 0.035% 0.2%
1.8-V version, IOUT = 0 mA, VIN = 3.2 V to 10 V 1 6 mV
3.3-V version, IOUT = 0 mA , VIN = 4.75 V to 15 V 1 6
Load regulation(1) Adjustable version, IOUT = 10 mA to 1 A, VIN – VOUT = 3 V 0.2% 0.4%
1.8-V version, IOUT = 0 mA to 1 A, VIN = 3.2 V 1 10 mV
3.3-V version, IOUT = 0 mA to 1 A, VIN = 4.75 V 1 10
VIN – VOUT Dropout voltage(2) IOUT = 100 mA 1.1 1.15 V
IOUT = 500 mA 1.15 1.2
IOUT = 1 A 1.1 1.25
ILIMIT Current limit VIN – VOUT = 5 V, TJ = 25°C 1 1.4 1.9 A
Minimum load current(3) Adjustable version, VIN = 15 V 1.7 5 mA
Quiescent current 1.8-V and 3.3-V versions, VIN ≤ 15 V 5 10 mA
Thermal regulation 30-ms pulse, TA = 25°C 0.01% 0.1% W
Ripple regulation fRIPPLE = 120 Hz, VIN – VOUT = 3 V, VRIPPLE = 1 VPP 60 75 dB
ADJUST pin current 60 120 µA
ADJUST pin current change IOUT = 10 mA to 1 A, VIN – VOUT = 1.4 V to 10 V 0.2 5 µA
Temperature stability 0.5%
Long term stability 1000 hrs, TA = 125°C 0.3%
RMS output noise Percentage of VOUT, f = 10 Hz to 10 kHz 0.003%
(1) Line and load regulation are measured at constant junction room temperature.
(2) The dropout voltage is the input and output differential at which the circuit ceases to regulate against further reduction in input voltage. It is measured when the output voltage drops 100 mV from the nominal value obtained by VIN = VOUT + 1.5 V.
(3) The minimum output current required to maintain regulation.

6.6 Typical Characteristics

LMS8117A graph_01_snos487.gif Figure 1. Dropout Voltage
LMS8117A graph_03_snos487.gif
Figure 3. Load Regulation
LMS8117A graph_05_snos487.gif
Adjustable version
Figure 5. Ripple Rejection
LMS8117A graph_07_snos487.gif
Figure 7. ADJUST Pin Current
LMS8117A graph_09_snos487.gif
3.3 V version
Figure 9. Load Transient Response
LMS8117A graph_11_snos487.gif
3.3 V version
Figure 11. Line Transient Response
LMS8117A graph_02_snos487.gif Figure 2. Short-Circuit Current
LMS8117A graph_04_snos487.gif
Adjustable version
Figure 4. Ripple Regulation vs Current
LMS8117A graph_06_snos487.gif
Figure 6. Temperature Stability
LMS8117A graph_08_snos487.gif
1.8 V version
Figure 8. Load Transient Response
LMS8117A graph_10_snos487.gif
1.8 V version
Figure 10. Line Transient Response