SNIS187A March   2015  – July 2015 LMT70 , LMT70A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Wide-Range Precision Active RTD or NTC Replacement (−55°C to 150°C)
  5. 5 Revision History
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Electrical Characteristics Temperature Lookup Table (LUT)
    7. 8.7 Switching Characteristics
    8. 8.8 Typical Performance Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Temperature Analog Output (TAO)
        1. 9.3.1.1 LMT70 Output Transfer Function
          1. 9.3.1.1.1 First Order Transfer Function
          2. 9.3.1.1.2 Second Order Transfer Function
          3. 9.3.1.1.3 Third Order Transfer Function
        2. 9.3.1.2 LMT70A TAO Matching
        3. 9.3.1.3 TAO Noise Considerations
        4. 9.3.1.4 TAO Capacitive Loads
      2. 9.3.2 TON Digital Input
      3. 9.3.3 Light Sensitivity
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Temperature Algorithm Selection
        2. 10.2.2.2 ADC Requirements
      3. 10.2.3 Finer Resolution LUT
      4. 10.2.4 Application Curves
    3. 10.3 System Examples
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Mounting and Temperature Conductivity
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Device and Documentation Support

13.1 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 4. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
LMT70 Click here Click here Click here Click here Click here
LMT70A Click here Click here Click here Click here Click here

13.2 Documentation Support

13.2.1 Related Documentation

Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.

IC Package Thermal Metrics application report, SPRA953

13.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

13.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

13.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.